- Bonders
- Applications
Laser Bar BondingSemiconductor lasers are versatile, light-emitting optical units which can be found in a variety of industrial applications. 
RFID AssemblyRFID (Radio Frequency Identification) tags are used as an alternative to bar codes for inventory control and theft protection. 
VCSEL & Photo DiodeThe assembly and packaging of optoelectronic devices is... 
Chip-on-Glass (CoG)Chip-On-Glass is a flip chip technology for direct connection assembly of ICs on glass substrates by using adhesive materials.
Optical Package AssemblyOptical packages are assemblies comprising optical and electronic components.
- Technologies
Ultrasonic / Thermosonic BondingUltrasonic / thermosonic bonding is a connection process that does not need bonding wires and is mainly used for Flip Chips.
ThermocompressionThermocompression bonding is a connection process that does not need bonding wires. It is mainly used in case of Flip Chip bonding.
Adhesive TechnologiesAdhesive materials can be applied between two join partners in various ways.
- Products
FINEPLACER® femtoAutomated Sub-micron Die BonderUp to 0.5 micron accuracy
Production platform
FINEPLACER® matrix maSemi-automatic Die BonderUp to 3 micron accuracy
300 mm wafer bonder
FINEPLACER® lambdaFlexible Sub-micron Die BonderUp to 0.5 micron accuracy
Application versatility
FINEPLACER® pico maMulti-purpose Die BonderUp to 5 micron accuracy
Application versatility
FINEPLACER® pico amaAutomated Flip Chip BonderUp to 5 micron accuracy
High flexibility
- Videos
Chip on Wafer AssemblyHow to video: Chip on Wafer Assembly
AuSn Laser Bar BondingHow to video: AuSn Laser Bar Bonding
Thermosonic BondingHow to video: Au-Au Thermosonic Bonding
Automatic AssemblyHow to video: Automatic Assembly
Ultrasonic BondingHow to video: Ultrasonic Bonding
Laser Bar BondingHow to video: Laser Bar Bonding
R&D BonderFINEPLACER® lambda - R&D Bonder
- Tutorials
Thermosonic Flip Chip BondingThe thermosonic bonding advantages and the disadvantages of lead-free solder are stimulating the growth of this low temperature gold-to-gold connection.
Optoelectronic Flip Chip AssemblyA growing requirement to include optical devices in microelectronic assemblies presents new challenges to the manufacturer.
- Applications
- Rework
- Applications
Rework of BGA / CSPBGA Rework has become synonymous for SMT Rework in general. Learn more...
Rework of Shielded SMDAs PCB real-estate continues to be in high demand, the RF shield design will remain a challenge to rework. 
QFN ReworkFlat packages such as QFN provide many benefits but make much higher demands compared to the handling of standard SMD components.
Small Passives Rework - 0100501005 small passive components are becoming more and more important these days (Integration, miniaturisation, etc.).
Package on Package (PoP)Package on Package (PoP) is an IC-packaging technology with vertical combined logic and memory components where ...
Underfill ReworkUnderfilled chips are used in consumer electronics, automotive industry or many miniaturized product.
Chip-on-Flex ReworkFlexible substrates are used in 3D connection and mechatronic concepts for...
Flip Chip ReworkFlip Chip rework is becoming more important in order to save costs by recycling valuable materials.
- Processes
Single Ball ReballingFinetech offers reliable reballing solutions for single ball replacement down to 200 µm dia.
Array ReballingThe accurate placement a new array of solder spheres is called array reballing.
Residual Solder RemovalThis section deals with the process related issue of eliminating residual solder once a component has been removed from a PCB. 
Apply Solder PasteFinetech offers various equipment solutions to integrate the suitable solder application method into the rework cycle.
- Products
FINEPLACER® coreplusThe perfect blend of performance and cost for ReworkProven technology where process reproducibility is critical
FINEPLACER® jumbo rsLarge Area Rework StationBoard sizes to 750 mm x 500 mm
FINEPLACER® pico rsHigh Density Rework StationRework in high density environments
FINEPLACER® micro hvrHigh Volume Rework StationBoard sizes to 350 mm x 260 mm
FINEPLACER® matrix rsFuture in Advanced ReworkSmallest pitch, most complex integration, largest array device capable
- Videos
- Applications
- Products
- Micro Assembly
FINEPLACER® femtoAutomated Sub-micron Die BonderUp to 0.5 micron accuracy
Production platform
FINEPLACER® matrix maSemi-automatic Die BonderUp to 3 micron accuracy
300 mm wafer bonder
FINEPLACER® lambdaFlexible Sub-micron Die BonderUp to 0.5 micron accuracy
Application versatility
FINEPLACER® pico maMulti-purpose Die BonderUp to 5 micron accuracy
Application versatility
FINEPLACER® pico amaAutomated Flip Chip BonderUp to 5 micron accuracy
High flexibility
- Advanced Rework
- FINEPLACER® coreplusThe perfect blend of performance and cost for ReworkProven technology where process reproducibility is critical
- FINEPLACER® jumbo rsLarge Area Rework StationBoard sizes to 750 mm x 500 mm
- FINEPLACER® pico rsHigh Density Rework StationRework in high density environments
- FINEPLACER® micro hvrHigh Volume Rework StationBoard sizes to 350 mm x 260 mm
- FINEPLACER® matrix rsFuture in Advanced ReworkSmallest pitch, most complex integration, largest array device capable
- Micro Assembly
- Company
