A FINEPLACER® pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.
Intel® Corporation has recognized Finetech with an Appreciation Award presented by Intel’s Equipment Vendor Enabling program.
Finetech announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma.
Since being introduced, the automated FINEPLACER femto has experienced rapid market acceptance of the die bonder’s capabilities, high accuracy placement and effective yields.
The bonding and packaging of laser bars, VCSELs, photo diodes, LEDs, sensors, and detectors requires high accuracy, superior optics, and process flexibility ….
Mobile device rework involves repairing densely populated boards with constricted space. Avoid disturbing neighboring components and the shifting of already placed package levels…