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Rework Applications:    
 
Pop Rework
PoP / BGA Rework
Get more information about hot gas rework technology for Package on Package or BGA components.
Small Passives
Approved solutions for rework of Small Passives (01005, 0201, 0402...).
QFN Rework
Read more about our "All in One" rework solution for QFN and MLF components.
Overview Rework Equipment    
 
Video Microscope Workstation FINEVIEWVideo Microscope Workstation
Opto Bonding & Micro Assembly:    
 
Laser Bar Bonding
Laser Bar Bonding
Read more about our solutions for bonding of laser bars / single laser.
stud bump flipchip bonding
FlipChip Bonding 
Learn more about FlipChip bonding, RFID Assembly and the high precision FINEPLACER® platform.
RFID assembly
RFID Assembly
Get more information about this new field of application for the FINEPLACER®, used for R&D as well as pre-series RFID production.
Overview Flip Chip Bonder Equipment     
 
Automatic Sub-Micron Flip Chip Bonder
Company Profile    
 
Company ProfileTake 3 minutes to learn more about FINETECH flip chip bonder and rework equipment.
Trade Shows    
 
Sep 06 - 09, 2008
CIOE 2008
Shenzen, China
Sep 9 - 12, 2008
GlobalTRONICS 2008
Singapore
Sep 21 - 25, 2008
ECOC 2008
Brussels, Belgium
Sep 23 - 25, 2008
Forum de l'électronique
Paris, France 
Sep 23 -26, 2008
Micronora 2008
Besancon, France
Sep 25 - 27, 2008
16. FED-Konferenz
Bamberg, Germany
Company News    
 
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