Rework Applications:

PoP / BGA Rework Get more information about hot gas rework technology for Package on Package or BGA components.

Small Passives Approved solutions for rework of Small Passives (01005, 0201, 0402...).

QFN Rework Read more about our "All in One" rework solution for QFN and MLF components.

Overview Rework Equipment

Video Microscope Workstation

Opto Bonding & Micro Assembly:

Laser Bar Bonding Read more about our solutions for bonding of laser bars / single laser.

FlipChip Bonding  Learn more about FlipChip bonding, RFID Assembly and the high precision FINEPLACER® platform.

RFID Assembly Get more information about this new field of application for the FINEPLACER®, used for R&D as well as pre-series RFID production.

Overview Flip Chip Bonder Equipment

Automatic Sub-Micron Flip Chip Bonder

Company Profile

Take 3 minutes to learn more about FINETECH flip chip bonder and rework equipment.

Trade Shows

Sep 06 - 09, 2008 CIOE 2008 Shenzen, China Sep 9 - 12, 2008 GlobalTRONICS 2008 Singapore Sep 21 - 25, 2008 ECOC 2008 Brussels, Belgium Sep 23 - 25, 2008 Forum de l'électronique Paris, France  Sep 23 -26, 2008 Micronora 2008 Besancon, France Sep 25 - 27, 2008 16. FED-Konferenz Bamberg, Germany

Company News

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