Blog

Welcome to the Finetech bonding blog…. where we will share our insights on applications and developments in die bonding and advanced packaging.

Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.

Latest Blogs

#18 - Moving from Prototype to Production

It's great to see our customers move from prototype and development bonding to production level bonding.

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#17 - A Toast to Cool Customers!

One of the best things about working at Finetech is we get to see some really incredible new technologies that our customers are trying to bring to market.

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#16 - Active Alignment in Photonics

The wide range of imaging sensors used in medical applications requires diversity in assembly tasks and bonding technologies.

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#15 - Medical Imaging Sensor Packaging

The medical industry is experiencing exponential growth in everything sensors and the range of imaging sensors used in medical applications is wide: [...]

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#14 - Another year!

Wow! What a year for Finetech!  In Berlin, we moved to a new, state of the art factory, introduced two NEW Die Bonders ...

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#13 - Flex Circuit bonding

We are increasingly asked about die bonding to flexible printed circuits by medical companies or bio-medical researchers ...

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#12 - FINEPLACER® sigma - Our New Baby

So why has our newest family member, the FINEPLACER® sigma, shaken things up?  Finetech has developed a new bonder that diverges from our existing optics and alignment technology...

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#11 - The Future of Finetech

Last month, I had the opportunity once again to visit our factory in Berlin, Germany. The Arizona heat in June alone is a great reason to get out of town and Germany is always enjoyable, but ...

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#10 - Medical Device Bonding

In the high precision world of medical electronics R&D and manufacturing, placement accuracy, process flexibility and reproducibility are critical.

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Archive

Find previous entries from Finetech's Bonding Blog.

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