Find previous entries from the Finetech bonding blog where we share our insights on applications and developments in die bonding and advanced packaging.
Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.
#9 - Show time!
#8 - Small Die Bonding
#7 - Sensors and Detectors Bonding
#6 - Coplanarity in Bonding
#5 - Optical Resolution for Bonding
#4 - ACF / ACP Bonding
#3 - Thermo-sonic Bonding: Small Die
In my last blog I wrote about the challenges involved with thermo-sonic bonding of large die. Thermo-sonic bonding of smaller die presents similar process issues – balancing the ratio of vacuum over force/energy/time.
#2 - Thermo-sonic Bonding: Large Die to Substrate
Thermo-sonic bonding is the process of flip chip bonding a die to a substrate using gold as the interconnect while avoiding high temperatures. Sounds pretty straight forward, but why then, is the process window so small regarding die size compared to surface area of gold, versus I/O count of the chip to substrate?
#1 - VCSEL and Photo Diode Alignment Simplified
Aligning a 4-channel VCSEL and a 4-channel photo diode together on a PCB, using conductive epoxy, is a challenging application for most telecom companies that develop and manufacture VSR or LR communication devices. The coupling efficiency is key to making this assembly successful.