Archive

Find previous entries from the Finetech bonding blog where we share our insights on applications and developments in die bonding and advanced packaging.

Innovative technologies require creative engineering – and we’ve seen a lot of them! We hope you will learn from our experiences, and contact us with any questions.

#11 - The Future of Finetech

Last month, I had the opportunity once again to visit our factory in Berlin, Germany. The Arizona heat in June alone is a great reason to get out of town and Germany is always enjoyable, but ...

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#10 - Medical Device Bonding

In the high precision world of medical electronics R&D and manufacturing, placement accuracy, process flexibility and reproducibility are critical.

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#9 - Show time!

It's been a busy couple of months for tradeshows, here and globally and we've debuted an exciting new bonding system.

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#8 - Small Die Bonding

At a recent conference, I was asked, "what is the smallest die that can be bonded on the Finetech equipment?

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#7 - Sensors and Detectors Bonding

When bonding area detectors and sensor devices, many process variables come into play -- alignment, oxidation, coplanarity, force and process environment (inert) ...

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#6 - Coplanarity in Bonding

There are very specific variables involved in finding solutions for optimizing bonding coplanarity, especially in die stacking and copper pillar processes ...

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#5 - Optical Resolution for Bonding

High accuracy die placement requires precise magnification and resolution. It is nearly impossible to achieve sub-micron placement without accurate use of both of these...

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#4 - ACF / ACP Bonding

Anosotropic Conductive Film and Paste use tiny polymer spheres coated with gold to make an electrical connection between die and substrate.  The bonding processes vary...

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#3 - Thermo-sonic Bonding: Small Die

In my last blog I wrote about the challenges involved with thermo-sonic bonding of large die.  Thermo-sonic bonding of smaller die presents similar process issues – balancing the ratio of vacuum over force/energy/time.

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#2 - Thermo-sonic Bonding: Large Die to Substrate

Thermo-sonic bonding is the process of flip chip bonding a die to a substrate using gold as the interconnect while avoiding high temperatures.  Sounds pretty straight forward, but why then, is the process window so small regarding die size compared to surface area of gold, versus I/O count of the chip to substrate?

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#1 - VCSEL and Photo Diode Alignment Simplified

Aligning a 4-channel VCSEL and a 4-channel photo diode together on a PCB, using conductive epoxy, is a challenging application for most telecom companies that develop and manufacture VSR or LR communication devices. The coupling efficiency is key to making this assembly successful.

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