FINEPLACER® Bonding Systems - Overview
Finetech offers bonding equipment for high-precision assembly, packaging and die attach.
The modular design of these systems provides maximum process flexibility for many bonding technologies - soldering, adhesive bonding, ultra-/thermosonic, thermocompression and UV curing.
Typical applications include the bonding and assembly of flip chips, MEMS, MOEMS, laser bars/laser diodes, VCSELs, sensors, CoF, CoG, LEDs, HB-LEDs and RFID.
FINEPLACER® femto
Automated Sub-micron Bonder
- 0.5 micron accuracy*
- Production platform
FINEPLACER® matrix ma
Semi-automatic Bonder
- 3 micron accuracy*
- 300 mm wafer bonder
FINEPLACER® lambda
Flexible Sub-micron Bonder
- 0.5 micron accuracy*
- Application versatility
FINEPLACER® pico ma
Multi-purpose Bonder
- 5 micron accuracy*
- Application versatility
FINEPLACER® pico ama
Automated Flip Chip Bonder
- 5 micron accuracy*
- High flexibility