FINEPLACER® femto

Automated Sub-micron Die Bonder

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced flip chip bonding and die attach applications.

This field approved system offers modular application architecture and can be flexibly equipped for a wide range of die bonding applications and processes. It is an ideal system for product and process development as well as production environments, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.

FINEPLACER® femto has the best cost - performance ratio of its class in the market.

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  • Die bonder FINEPLACER® femto

Highlights*

  • Sub-micron placement accuracy
  • Handles ultra small to very large components
  • Fully-automated operation and assembly process
  • Supports wafer/substrate sizes up to 300mm
  • Supports bonding forces up to 500 N
  • Economically flexible platform architecture
  • Small footprint and compact design
  • Long-term stability and support

* depending on configuration and application

Features

  • Automated pattern recognition, alignment and bonding
  • Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
  • Integrated Process Management (IPM)
  • Adaptive process library
  • Live process observation camera
  • Virtually unlimited range of advanced bonding technologies

Benefits

  • Fully automated, user independent process
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Fast and easy process development
  • Immediate visual feedback reduces process development time
  • ROI savings - one machine for all applications

Technologies

Applications

  • Precise die bonding (face up)
  • Flip chip bonding (face down)
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging, Bump Bonding
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Copper pillar bonding
  • Active alignment bonding

Technical Specifications*

Placement accuracy*:± 0.5 µm
Field of view (min)1:0.27 mm x 0.2 mm
Field of view (max)1: 3.2 mm x 2.4 mm
Component size (min):0.05 mm x 0.05 mm
Component size (max):100 mm x 100 mm
Component thickness (max)1:0.01 - 10 mm
Substrate size:on customer request
Substrate thickness (max)1:35 mm
Theta fine travel:± 9° / 3.5 µrad
Z-travel / accuracy:10 mm / 0.2 µm
Y-travel / accuracy:150 mm / 0.1 µm
X-travel / accuracy:450 mm / 0.1 µm
Heating temperature2:450 °C
Bonding force range*:0.05 N - 500 N

* depending on configuration/application
1 other values on request and depending on configuration
2 optional module

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