Automated Sub-micron Die Bonder

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced flip chip bonding and die attach applications. The Vision Alignment System is combined with automatic pattern recognition for high-precision alignment and sub-micron bonding results.

This field approved system offers modular application architecture and can be flexibly equipped for a wide range of die bonding applications and processes. It is an ideal system for product and process development as well as production environments in the opto-electronics sector. The platform is capable of accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.

FINEPLACER® femto has the best cost - performance ratio of its class in the market.

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    Die bonder FINEPLACER® femto


  • Pattern recognition for automatic alignment as standard
  • Fully-automated operation and assembly process
  • Manual mode for instant operation
  • Sub-micron placement accuracy
  • Handles ultra small to very large components
  • Wide range of component thicknesses
  • Supports wafer/substrate sizes up to 300mm
  • Supports bonding forces up to 500 N
  • Small footprint and compact design
  • Long-term stability and support


  • Automated pattern recognition, alignment and bonding
  • Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
  • Integrated Process Management (IPM)
  • Adaptive process library
  • Live process observation camera
  • Virtually unlimited range of advanced bonding technologies


  • Fully automated, user independent process
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Fast and easy process development
  • Immediate visual feedback reduces process development time
  • ROI savings - one machine for all applications



  • Precise die bonding (face up)
  • Flip chip bonding (face down)
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging, Bump Bonding
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Copper pillar bonding
  • Active alignment bonding

Technical Specifications*

Placement accuracy*:±0.5 µm 
Field of view (min)1:0.27 mm x 0.2 mm
Field of view (max)1: 3.2 mm x 2.4 mm
Component size (min):0.05 mm x 0.05 mm
Component size (max):100 mm x 100 mm
Component thickness (max)1:0.01 - 10 mm
Substrate size:on customer request
Substrate thickness (max)1:35 mm
Theta fine travel:± 9° / 3.5 µrad
Z-travel / accuracy:10 mm / 0.2 µm
Y-travel / accuracy:150 mm / 0.1 µm
X-travel / accuracy:450 mm / 0.1 µm
Heating temperature2:450 °C
Bonding force range*:0.05 N - 500 N

* depending on configuration/application
1 other values on request and depending on configuration
2 optional module