Flexible Sub-micron Die Bonder

The FINEPLACER® lambda is a flexible sub-micron bonder used for high accuracy die attach and component placement in advanced packaging. The system offers a modular design and can be easily reconfigured for future applications.  Integrated options provide flexibility and convenience - such as programmable UV curing and side camera observation/capture.

It is the ideal choice for low volume production, prototyping, education and R&D environments where process flexibility is the key. 

This cost- effective die bonder handles a wide range of sophisticated processes, including Indium and eutectic bonding as well as extremely sensitive materials such as GaAs or GaP. 

  • Die bonder FINEPLACER® lambda
  • Flash is required!


  • Sub-micron placement accuracy
  • Unique optical resolution
  • Handles ultra small components
  • Special tools allow object sizes down to 5 µm
  • Supported substrate size up to 6"
  • Closed loop force control
  • Small footprint and compact design
  • Optics movement with programmable positions

* depending on configuration and application


  • Automated processes (temperature, force)
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Robust construction and modular design
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Adaptive process library
  • Process transfer from system to system
  • Virtually unlimited range of advanced bonding technologies


  • User independent die placement and process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Provides high level of reproducibility and application flexibility
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development
  • Process transfer from R&D to production saves time, guarantees reliable results
  • ROI savings - one machine for all applications



  • Precise die bonding (face up)
  • Flip chip bonding (face down)
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging, Bump Bonding
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Copper pillar bonding
  • Active alignment bonding

Technical Specifications

Placement accuracy:± 0.5 µm
Field of view (min)1:0.4 mm x 0.3 mm
Field of view (max)1:6 mm x 4.5 mm
Component size (min)1:0.1 mm x 0.1 mm
Component size (max)1:15 mm x 15 mm
Theta fine travel:± 5°
Z-travel10 mm
Working area1:190 mm x 52 mm
Bonding force range2*:0.1 N - 400 N
Heating temperature (max)1,2*:400 °C

* depending on configuration/application
1 other values on request and depending on configuration
2 optional module