FINEPLACER® matrix ma

Semi-automatic Die Bonder

The FINEPLACER® matrix ma is a semi-automatic bonder providing a stable, high accuracy solution for a broad range of component and substrate sizes, and a bonding area up to 300mm.

Incorporating an ergonomic approach to bonder design, this state-of-the-art platform, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications including flip chip bonding, photonics and wafer level packaging, this system uses numerous die bonding technologies which ensures compatibility with future technologies as users transition from R&D into production.

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    Die bonder FINEPLACER® matrix ma


  • Placement accuracy 3 µm
  • Components from 0.1 mm x 0.1 mm to 150 mm x 150 mm
  • Substrate sizes up to 350 mm x 350 mm
  • Supports wafer sizes up to 300 mm
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Low maintenance, easy service access as a design priority
  • Fast conversion from die bonder to rework station


  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Process transfer from system to system
  • Virtually unlimited range of advanced bonding technologies 


  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Process transfer from R&D to production saves time, guarantees reliable results
  • ROI savings - one machine for all applications



  • Precise die bonding (face up)
  • Flip chip bonding (face down)
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging, Bump Bonding
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Copper pillar bonding
  • Active alignment bonding

Technical Specifications

Placement accuracy:3 µm
Field of view (min)1:1.2 mm x 0.9 mm
Field of view (max)1:15.7 mm x 11.9 mm
Component size (min)1:0.1 mm x 0.1 mm
Component size (max)1:100 mm x 100 mm
Theta fine travel:± 2°
Z-travel10 mm
Working area1:310 mm x 197 mm
Bonding force (max)2*:500 N
Heating temperature (max)1,2*:400 °C

* depending on configuration/application
1 other values on request and depending on configuration
2 optional module