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FINEPLACER® pico ama

Automated Flip Chip Bonder

The FINEPLACER® pico ama is a cost effective, fully-automated bonder, offering a high level of application flexibility.

This award winning system is targeted for low volume production environments, as well as product and process development where flexibility is crucial.

  • Die bonder FINEPLACER® pico ama
  • Flash is required!

Highlights

  • Placement accuracy 5 µm @ 3 sigma*
  • Components from 0.125 mm x 0.125 mm to 40 mm x 50 mm*
  • Working area up to 450 mm x 117 mm*
  • Supports wafer/substrate sizes up to 8" *
  • Supports bonding forces up to 50 N*
  • Closed loop force control
  • Fully automatic operation and assembly process
  • Precise non-wearing xy planar table
  • Traceability support with open data interface structure
  • Flexible, cost effective performance

* depending on configuration and application

Features

  • Automated pattern recognition, alignment and bonding
  • Overlay vision alignment system with fixed beam splitter
  • Integrated Process Management (IPM)
  • Adaptive process library
  • Live process observation camera
  • Virtually unlimited range of advanced bonding technologies

Benefits

  • Full automatic, user independent process
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Fast and easy process development
  • Immediate visual feedback reduces process development time
  • ROI savings - one machine for all applications

Technologies

Applications

Technical Specifications

Placement accuracy:5 µm @ 3 sigma
Field of view (min)1:2 mm x 1.5 mm
Field of view (max)1:14 mm x 10.5 mm
Component size (min)1:0.125 mm x 0.125 mm
Component size (max)1:40 mm x 25 mm
Theta fine travel:± 6° / 1 m°
Z-travel / resolution:10 mm / 0.8 µm
Y-travel / resolution:155 mm / 0.64 µm
X-travel / resolution:380 mm / 0.64 µm
Working area1:380 mm x 117 mm
Bonding force range1*:0.1 N - 50 N
Heating temp. (max)1,2*:400 °C

* depending on configuration/application
1 standard value, other values on request
2 optional module