FINEPLACER® pico ma

Multi-purpose Die Bonder

The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.

This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.

  • Die bonder FINEPLACER® pico ma
  • Flash is required!

Highlights*

  • Placement accuracy 5 µm
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm
  • Working area up to 450 mm x 234 mm
  • Supports wafer/substrate sizes up to 200 mm
  • Supports bonding forces up to 700 N
  • Can be configured as a hot air rework system 
  • Manual and semi-automatic configurations

* depending on configuration and application

Features

  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Advanced system software with adaptive process library
  • Process transfer from system to system
  • Process flexibility due to modular concept

Benefits

  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development, process recording and reporting, photo capture
  • Process transfer from R&D to production saves time, guarantees reliable results
  • One system handles a wide variety of applications

Technologies

Applications

  • Precise die bonding (face up)
  • Flip chip bonding (face down)
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging, Bump Bonding
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Copper pillar bonding
  • Active alignment bonding

Technical Specifications

Placement accuracy:5 µm
Field of view (min)1:1.6 mm x 1.2 mm
Field of view (max)1:20 mm x 15 mm
Component size (min)1:0.125 mm x 0.125 mm
Component size (max)1:40 mm x 40 mm
Theta fine travel2:± 6°
Z-travel210 mm 
Working area1:280 mm x 117 mm
Heating temp. (max)1,2*:400 °C
Bonding force (max)1,2*:700 N

* depending on configuration/application
1 other values on request and depending on configuration
2 optional module

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