Multi-purpose Die Bonder

The FINEPLACER® pico ma is our most cost effective bonder designed for prototyping or low-volume production, R&D labs and universities.

This versatile platform is used in a wide range of micro assembly applications – such as flip chip bonding, die attach and components requiring a novel bonding approach.

  • Die bonder FINEPLACER® pico ma
  • Flash is required!


  • Placement accuracy 5 µm
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm
  • Working area up to 450 mm x 234 mm
  • Supports wafer/substrate sizes up to 200 mm
  • Supports bonding forces up to 700 N
  • Can be configured as a hot air rework system 
  • Manual and semi-automatic configurations


  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Advanced system software with adaptive process library
  • Process transfer from system to system
  • Process flexibility due to modular concept


  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development, process recording and reporting, photo capture
  • Process transfer from R&D to production saves time, guarantees reliable results
  • One system handles a wide variety of applications



  • Precise die bonding (face up)
  • Flip chip bonding (face down)
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging, Bump Bonding
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Copper pillar bonding
  • Active alignment bonding


* depending on configuration/application
1 other values on request and depending on configuration
2 optional module