Semi-automatic Sub Micron Bonder

The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding and flip chip applications ready to be pushed toward wafer level. This includes complex 2.5D and 3D IC packages, Focal Plane Arrays (i.e. image sensors), MEMS/MOEMS, and more.

Placing small devices on large substrates is made possible by the FPXvisionTM optical system design. With this alignment system, the smallest structures at the highest magnification can be viewed across the entire field of view. Moreover, FPXvisionTM introduces pattern recognition to a die bonder with manual alignment.

The FINEPLACER® sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies.

  • Die bonder FINEPLACER® sigma
  • Flash is required!


  • Sub micron placement accuracy
  • Capable for substrates up to 300 mm 
  • Bonding forces up to 1000 N
  • FPXvisionTM - high resolution for all magnifications
  • Software guided alignment verification
  • Touch screen GUI 
  • Modular design for flexible configurations


  • Alignment position verification via digital pattern recognition
  • Sub micron placement accuracy for substrate sizes up to 450 x 300 mm2
  • Easy process module integration allows individual machine configurations
  • Software based process management with touch screen operation
  • Integrated Bonding Force Module up to 1000 N*


  • Operator independent alignment process and automatic process run
  • High precision chip assembly to wafer
  • Virtually unlimited spectrum of bonding technologies
  • Comprehensive, easy to use parameter optimization
  • Latest bonding technologies, such as sintering, Cu/Cu and many more



  • Wafer level packaging (FOWLP, W2W, C2W)
  • 2.5D and 3D IC packaging (TSV)
  • Multi chip packaging (MCM, MCP)
  • Flip chip bonding (face down)
  • Precision die bonding (face up)
  • µLED and µLED array bonding
  • Optical package assembly
  • MEMS/MOEMS packaging
  • Sensor assembly
  • Glass-on-glass, chip-on-glass, chip-on-flex

Technical Specifications*

Placement accuracy: ±0.5 µm
Field of view: 3.8 mm x 2.7 mm
Field of view resolution: 1µm / pix
Extended field of view: 83 mm x 2.7 mm
Component size (min): 0.07 mm x 0.07 mm
Component size (max):100 mm x 100 mm
Substrate support (max):300 mm x 300 mm
X-travel / resolution1:2.5 mm / 1 µm
Y-travel / resolution1:2.5 mm / 1 µm
Z-travel / resolution:10 mm / 10 µm
Theta travel:±15° (±2° fine travel)
Working area:450 mm x 150 mm
Bonding force range2:0.2 - 40 N / 1 - 1000 N
Heating temperature:450 °C