Spinner
 

Finetech Supports Universities

This drawing for a 5 µm pico-bonder is open to US and Canadian qualified Universities and Colleges. Increase your facilities’ chance of winning – tell your colleagues to register.   

Why is Finetech doing this? 
The university community provides a wonderful opportunity to showcase our products in some of the world’s most prestigious institutions - and many students have become valuable industry ambassadors and users of Finetech bonders. This is our way of returning the confidence placed in us.

And, it's our 20th birthday this year ! In celebration we make this exciting offer to you. 

Flexibility

As you can see from the ‘word cloud’, this bonder has unparalleled application flexibility and modularity – a true ‘all-in-one’ platform for your advanced packaging and assembly applications.

Application versatility

  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro-optics assembly and lens attach
  • MEMS assembly & packaging
  • Sensor packaging
  • 3D packaging
  • Flip Chip
  • Wafer level integration (W2W, C2W)
  • Chip on glass, chip on flex
  • Precise die bonding

Winning System Configuration

  • FINEPLACER® pico ma (Base System)
  • Look-down camera
  • Fine Rotation Arm (for die)
  • Force Arm (manual) to 20N
  • X,Y,Z Table for substrate
  • Substrate Heating Plate to 400C
  • Chip Heating Module to 400C
  • Side Camera with 180° view
  • PC, Frame Grabber and Monitor
  • FINEPLACER® Process Control Software
  • Shipping, Installation & Training
  • One year warranty

Tech Specs

Placement accuracy:5 µm
Field of view (min):1.6 mm x 1.2 mm
Field of view (max):20 mm x 15 mm
Component size (min):0.125 mm x 0.125 mm
Component size (max):40 mm x 40 mm
Theta fine travel:± 6°
Z-travel10 mm 
Working area:280 mm x 117 mm
Heating temp. (max):400 °C
Bonding force (max):400 N