Precision Vacuum Die Bonding

Soldering components in fine and high vacuum in microelectronics production is a very challenging process. However this process offers major advantages over common/traditional production processes. Even without flux and partially without protective atmosphere, it is possible to avoid oxidation and to achieve nearly void free bonds. The results are bonds with better long life fatigue strength and considerably improved electrical and/or thermal conductivity. This is a prerequisite for even small form factors and higher performance levels of electronic and optoelectronic micro systems.

In our industry, vacuum soldering systems which are freely available on the market, require the component to be placed and clamped outside the vacuum chamber on a fixture before the fixture is placed into the actual vacuum chamber and the process can begin.

Finetech's Vacuum Chamber Module provides an integrated solution.

Presentation: Precision Vacuum Die Bonding

Finetech has developed a vacuum chamber module, which can be integrated into FINEPLACER® micro assembly systems.

Like during the normal bonding process, the component is picked up from the presentation and oriented prior to placement. When placing the component onto the substrate or header, the lid of the chamber is automatically closed. Afterwards the vacuum soldering process starts.

The combination of a micro assembly system and vacuum chamber represents a simply, yet highly flexible solution, which allows to manufacture small and medium sized lots in a very cost effective manner. 

This presentation on the Vacuum Chamber Module was held by Finetech's own Dr. Matthias Winkler during the Micro Assembly Day 2016 in Berlin.

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