Sub Micron Die Bonder

FINEPLACER® sigma - sub micron sensor assembly

The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 300 mm2 working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding and flip chip applications ready to be pushed toward wafer level. This includes complex 2.5D and 3D IC packages, FPA (i.e. image sensors), MEMS/MOEMS, and more.