Wednesday, 25. January 2017

Finetech to Present Development Equipment for Optical Sub-Assemblies at Photonics West 2017

One particularly demanding optoelectronic application is the assembly of modern communications modules. Read more

Category: America

Monday, 16. January 2017

National Optics Institute (INO) Selects Finetech's Sigma Bonder

Canada's largest center of expertise in optics and photonics to use the Sigma die bonder for MOEMS research, photonic advanced packaging ...Read more

Category: America

Monday, 07. November 2016

Innovative Solutions for Precision Die Bonder FINEPLACER® lambda

With the acclaimed sub-micron die bonder FINEPLACER® lambda, German equipment manufacturer Finetech offers one of the most compelling high-precision die packaging systems for flexible process and product development. A number of...Read more

Category: Europe, America