Finetech to Present Development Equipment for Optical Sub-Assemblies at Photonics West 2017
One particularly demanding optoelectronic application is the assembly of modern communications modules.
Finetech serves customers around the world who engage in the development and manufacturing of optical transceiver modules (TOSA/ROSA) with bandwidths from 25 G to 100 G. Even with 25 G modules, the maximum placement error is only ±5 µm in x and y and ±1 µm in z. The maximum angular error θ must not exceed ± 0.5°. All these specifications must be met post-bond.
Assembling optical transceiver modules is a multi-step process which presents a number of challenges. The laser diode arrays must be aligned to the PD array with highest (post-bond) accuracy. Optical active surfaces are touch-free zones, therefore specialized glass mask tooling is required to handle the component. There is the need to work in different focal planes. And finally, different bonding technologies are required -- such as gluing, fluxless soldering or thermo-compression, with variable process parameters to be able to build the entire optical transceiver module on the same machine.
Opto-Bonder FINEPLACER® lambda Supports Complete TOSA/ROSA Assembly Process
With the high-precision Opto-Bonder® FINEPLACER® lambda, Finetech offers a sub-micron die bonder perfectly suited for complete high-precision assembly of opto-electronic sub-modules.
The system comes with outstanding optical resolution. Customers can opt for a Vision Alignment System which provides a resolution of 0.7 µm. This presents new opportunities when working with ultra small components of 100 µm and less. The ability to see the smallest structures renders the FINEPLACER® lambda an ideal fit for precision die attach and advanced packaging in photonics and opto-electronic applications. Available in manual or motorized configurations, this bonder is the premier choice when maximum technological versatility and fast process implementation are crucial. Typical fields of application include R&D, universities, prototyping and low-volume production.
The FINEPLACER® lambda is capable of handling component sizes from 0.07 x 0.07 mm² to 60 x 90 mm² on a working area up to 190 mm x 52 mm. Wafer sizes up to 6'' are supported. A wide range of applications can be handled, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode array bonding (gluing, curing), the assembly of lenses, mirrors or filters, and the multi-stage assembly of micro-opto-electro-mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.