FINEPLACER® Micro HVR*

FINEPLACER^® Micro HVR
High Volume Rework

The patented FINETECH platform with vision alignment system (VAS) forms the basis for the automatic rework system. Based on a stationary beam splitter, the reliability of this working principle has been proven at several hundred installations worldwide.

A highly accurate and ”friction-free“ positioning table, with x,y planar motor and high resolution z axis control, is integrated. An additional fast linear axis enables large substrates to be accommodated, as well as a provision for component storage in trays or waffle paks. Likewise, the FINETECH pivot arm with component rotation capability is automated for hands-free placement.

Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate, providing a complete rework process including the patented ”single-sweep“ residual solder removal technique. All versions of the automatic FINEPLACER^® Micro HVR System have a placement accuracy better than 10 µm, sufficient for the highest demands from large Super BGA down to µBGA, CSP and Flip Chip repair.

FINEPLACER^® Pico RS (modular rework system for smallest components and mobile devices)
FINEPLACER^® Micro RS (modular rework system for advanced and standard rework)
FINEPLACER^® Micro HVR (automatic rework station for advanced and standard rework)
FINEPLACER^® CRS (compact rework system for advanced and standard rework)
FINEPLACER^® Jumbo (modular rework system for very large board sizes)
FINEPLACER^® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications)

^{*the configuration shown on the picture may contain optional modules}