Heating plates must be clamped into the PCB holder of the air bearing positioning table. They are used for heating substrates from beneath during the bonding process.
Different types of heating plates are availabe which differ e.g. in dimensions of heated area, power and speed.
FA7CV - FA10CV
High Speed Heating Plate FA7CV
All heating plates are able to withstand forces of up to 100 N without bending. All heating plates come with internal forced air cooling to provide rapid temperature ramps.
Inert gas chambers are available for all heating plates. They may be used to avoid undesired oxygen induced chemical reactions at the bonding joint. To achieve optimal control of the process parameters, the inert gas can optionally be preheated with a PC controlled temperature profile.
Features and Benefits
Rapid heating, temperature controlled
Invar steel heating area for minimal thermal expansion
Integrated tray carrier
Rapid gas cooling
Vacuum holder, also useful for flexible substrates (optional)
Inert gas system (optional)
FA10CV without thermal movement in one defined area
Maximum temperature limited to a maximum of 2 minutes
Controller optimizable over the whole temperature range
The High Speed Graphite Heater is suitable for single process of small components with sensitive structure and was especially developed for applications with strong time demands.
Features and Benefits
Max. temperature: 400°C
Max. temperature increase rate: 100K/s (heater controlled)
Power: 800 W
Rapid cooling
Vacuum for component
Integrated inert or forming gas outlet
2 inch tray holder
Adaptable for different heat sink / c-mount designs
