Original FINETECH Soldering Heads
FINETECH Soldering Heads have to fulfil multiple tasks:
- Pick up the component from the presentation
- Clamp the component during alignment
- Place the component on the PCB
- Heat the component during reflow
In specific cases:
- Apply force to the component
- Supply the working aria with shielding gas
According to their task, FINETECH Soldering Heads are task specific. They solder and desolder different kinds and sizes of SMD components, such as BGA (hard and soft balls), CSP, FC, QFP, PLCC, RF shields, connectors, modules and small passives, on very densely populated boards, e.g. for mobile phones.
All FINETECH Soldering Heads are optimized for lowest thermal mass. This means the influence of heat stored in the soldering head is minimized and hot gas is lead to the connections to solder on the shortest way possible. Working together with FINETECH's COMISS Reflow Module, FINETECH Soldering Heads provide hot gas temperature curses following the desired values with excellent accuracy. Extremely quick preheating and cooling is possible.
For high sensitivity applications, like soldering plastic connectors or replacing RF shields, as well as reworking TAB and flex connectors, custom specific FINETECH Soldering Heads were designed, for soldering within a few seconds and minimizing the thermal stress to the component.
All soldering heads fit into the reflow arm's quick clamping device, making tool change a job of just a few seconds.
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