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RFID AssemblyRFID (Radio Frequency Identification) is a new field of application for the FINEPLACER®, used for R&D as well as pre series RFID production. The size covers a range from some mm to 0.5 mm.
Low placement error becomes more and more important, as RFID dice are undergoing a continuous process of miniaturization. Flexibility and process reproducibility are further "trump cards" for quick process development.
Internal structure of an RFID tag:
- Micro chip, containing electronics and storage
- Antenna, most times also supplying energy to the electronics ("passive tag")
- The electronics is covered by a shell
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| Very different embodiments have been developed to meet specific demands: |
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RFID tags are used as replacement of bar codes in "intelligent stores", as well as for protection against theft. These applications make them a typical mass product.
The substrate material is Polyethylenterephthalate (PET) in most cases, which is thin (0.1 mm), soft and floppy, as well as thermally sensitive (max. 80°C). This makes well controlled process parameters necessary.
RFID antennas are presented on large size sheets, 30 mm x 20 mm is not unusual. Several modules are on one sheet, and even for test purposes, customers don't like to cut these into pieces. |
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All steps of RFID assembly can be accomplished with a FINEPLACER®. Depending on the customers needs, manual and automatic models with a multitude of optional configurations are available.
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The FINEPLACER®s flexibility allows optimizing different RFID bonding processes, such as adhesive bonding and US bonding. Optimized process parameters can be found easily, as temperature, time and force can be changed in no time.
R&D test assemblies can be set up quickly for rapid prototyping, e.g. finding the proper material combination and to generate samples for
- Adhesive testing
- Ageing tests
- Electrical optimization
- Fatigue tests
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During alignment and placement, the chip is hold at die collet by vacuum. During bonding, the die collet performs transversal oscillations, where ultrasonic energy is transferred via the die collet's front face by friction, without further clamping means. |
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Ultrasonic Bonding of an RFID chip:
- Process Parameters
- P = 1 W
- T = room temperature
- t = 500 ms |
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| Adhesive Technology - ACP | |
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| The first step is applying ACP to the antenna using a dispensing cannula. After that, pick-up component from wafer, alignment and placement. During all handling, the chip is hold at pick&place tool by vacuum. The placement and curing process can be viewed on the monitor. |
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Overlay picture of antenna and chip |
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Die collet with chip before placement |
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RFID chip after ACP bonding
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| Fully equipped FINEPLACER® Micro MA for Micro Assembly | |
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| The FINEPLACER® Micro MA can be used in a wide field of application. The machine shown on the right is a motorized thermo compression die bonder with optional die picking module for wafer frames.
The FINEPLACER® Micro MA offers high accuracy of 10 µm (0.4 mil) placement accuracy, allowing to bond smallest dice with a pitch of down to 50 µm. Compared to the Pico MA, the machine offers an enlarged working space and therefore it can be used with wafers up to 8" diameter, with full access to each die.
Typical fields of application are
- RFID assembly
- Sensor assembly
- Chip on flex
- Embedded components
- LED bonding
- Chip to wafer bonding (8'')
All established micro assembly methods can be executed, such as
- Die attach
- FlipChip bonding
- Soldering (AuSn, Indium)
- Thermocompression
- Ultra-/thermosonic
- C4 soldering
-ACF/ACP/NCP
- Curing
- UV
- Temperature |
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| FINEPLACER® Pico AMA - Application Package for RFID | back to top |
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The Pico AMA consistently combines the FINEPLACER®'s high accuracy with automatic pattern recognition, opening the possibility to produce batches of pre series RFID modules with identical or custom modified properties. All steps of the automatic production process are integrated:
- Dispense adhesive on antenna
- Pick up component from wafer
- Flip component
- Place component on transfer station
- Pick up component from transfer station
- Align component to target structure
- Place component on antenna
- Bond component to antenna
The automatic RFID bonder is equipped with wafer picker incl. flipping unit and dispenser. The dispenser works with simple pressure time control. It is able to handle heat curing adhesive, it is easy to clean and provides sufficient dosing precision. |
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Click on the PDF icon to load the application flyer for:
RFID Assembly |
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