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FINEPLACER® Lambda
Manual Sub-Micron Die Bonder (motorized)
The Lambda can be equipped with the motorized module package consisting of the Motorized Bonding Force Module, Motorized Camera Movement, PC Control and Bonding WinFlipChip Software. The FINEPLACER® Lambda provides auto-touchdown and die placement as well as controlled bonding operation after manual alignment of die and substrate.
Benefits:
- Highest placement accuracy ±0.5 µm
- Places die with dimensions exceeding the optical field of view
- Patented vision alignment system
- High level of flexibility through modular design
- Manual and motorized configurations
- User independent and reproducible process
- Hands-off die placement
- Small footprint and compact design with minimal number of moving parts
- Up to 10 programmable microscope positions
- Upgradeable with integrated microscope measurement function and an alignment mask generator
- Adaptable to handle specific applications
- Designed for low volume production, universities and R&D
- Ready for sophisticated future technologies
- Low cost of ownership
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FINEPLACER® Lambda
Manual Sub-Micron Die BonderUsed for the most sophisticated die attach tasks, such as bonding of FlipChips, Micro Electro Mechanical Systems (MEMS), Micro Opto Electro Mechanical Systems (MOEMS), and sensors, on substrate sizes up to 180 mm x 136 mm. The placement accuracy is ± 0.5 µm for the manual Lambda configuration.
Different viewing equipment is availabale: LEICA microscope (A6), or high resolution video optics (A6V, A7V). A wide range of process modules are available for attaching the above named components using today's latest technologies.
Learn more about application examples for the FINEPLACER® Lambda system:
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Technical Specifications & Optional Modules |
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Technical Specifications |
| Placement accuracy: |
± 0.5 µm |
| Max. Board size |
max.180 mm x 136 mm |
| Chip sizes: |
up to 40 mm |
| Bonding Force: |
min. 0.1 N, max. 500 N | |
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All steps of laser bar assembly can be carried out by the system - including handling and flipping of laser bar, transfer of submount or heatsink, bonding or soldering. The patented vision aligment system guarantees precise bonding results. After alignment and gently placement of the laser bar the software controlled AuSn or Indium soldering process starts. The beam outlet area of the assembled module can be inspected using the integrated facette inspection module. A sub-micron accuracy can be achieved by the system. |
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Facette inspection |
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4 x tray holder |
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Heating plate
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Click on the PDF icon to load the product flyer for:
FINEPLACER® Lambda |
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Click on the PDF icon to load the application note for:
Packaging Technologies of VCSEL |
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| In case your access to our online media service is blocked due to 3rd party file storage restrictions, please use the contact form to get in contact with us and we will send you the desired documents as soon as possible. We apologize for any inconvenience. |
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