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FineplacerPico Automatic Micro AssemblyZoom FINEPLACER® Pico AMA*

FINEPLACER® Pico AMA
Automatic Micro Assembly

FINEPLACER® Pico AMA is an innovative, automatic micro assembler that offers users extreme modularity and flexibility. Because the system is based on a modular platform, it offers a high range of flexibility and can be applied to a wide range of applications. Additionally, the ability to upgrade and retrofit provides significant cost benefits to users - it provides an “all in one” cost-saving solution.

With a high placement accuracy of 5 µm @ 3 ó, the FINEPLACER® Pico AMA is ideal for the advanced placement and bonding of optoelectronic components, MEMS, multichip modules, sensors, RFID assembly, and more. The system is versatile for many bonding techniques, including flip chip (thermocompression, ultrasonic, and soldering), dispensing, UV curing, fluxing and ACP.  Picture processing, self-propelled positioning table and placement arm, as well as automatic force generation, allow the system to bond numerous, like components continuously, resulting in throughput improvement.

The FINEPLACER® Pico AMA is operator independent – providing stability and increased process safety for a production environment.
Benefits:
  • Patented vision alignment system ensures placement accuracy of 5 µm @ 3 σ
  • Fully automatic operation and assembly process
  • 100 % operator independent
  • Closed loop control of temperature and force
  • High level of flexibility due to modular concept
  • Easy adaptable for different applications
  • Die Pick-Up from blue tape, flipping module
  • Precise non-wearing x,y planar table
  • Stable and compact system with minimal numbers of moving parts
  • Flip Chip Bonding Software with Windows® GUI
  • Open data interface structure to assembly line
Technical Specifications & Optional Modules back to top  
 
Technical Specifications
Placement Accuracy:
5 µm @ 3 σ
Placement Area:
280 mm x 115 mm
x,y Travel Range:
380 mm x 155 mm
x-Axis Travel Range:
10 mm
Rotation of Placement Head:
360°

Rotation of Tool
 180°
Optional Modules
Inspection Video Module VARIOPlus
Heating Module With Inert Gas Chamber
Die Pick-Up Module
Automatic Die Handler DH6
Application Modules (UV, Ultra-sonic, Dispensing...)
RFID Reader / Barcode Reader
Traceability Module
Application Package for Automatic Laser Bar Bonding back to top
 
FINEPLACER Pico AMA for Laser Bar AssemblyFINEPLACER® Pico AMA for Laser Bar Assembly
All steps of laser bar assembly can be carried out by the system - including batch recognition, handling and flipping of laser bar, transfer of submount or heatsink, bonding or soldering. The automatic vision aligment system eliminates the operator influence of the bonding result. After alignment and gently placement of the laser bar the controlled Indium and AuSn soldering process starts. The post bond accuracy of the assembled module can be measured by the integrated measurement module. An accuracy significantly better than 5 µm @ 3 σ can be achieved by the system.
Die Flipping Module for Laser Bars Substrate Handling Module Measurement Module
Die Flip Module Substrate Handling Module Measurement Module (post bond accuracy)
Configuration for Laser Bar Assembly
Inspection Video Module VARIOPlus
Heating Module With Inert Gas System
Substrate Handling Module
Measurement Module (Post Bond Accuracy)
Vision Alignment System
RFID Reader (Traceability)
Die Flip Module
  
FINEPLACER® Pico AMA - Application Package for RFID back to top
 
RFID Bonder automaticFINEPLACER® Pico AMA

The Pico AMA consistently combines the FINEPLACER®'s high accuracy with automatic pattern recognition, opening the possibility to produce batches of pre series RFID modules with identical or custom modified properties. All steps of the automatic production process are integrated:

  • Dispense adhesive on antenna
  • Pick up component from wafer
  • Flip component
  • Place component on transfer station
  • Pick up component from transfer station
  • Align component to target structure
  • Place component on antenna
  • Bond component to antenna

The automatic RFID bonder is equipped with wafer picker incl. flipping unit and dispenser. The dispenser works with simple pressure time control. It is able to handle heat curing adhesive, it is easy to clean and provides sufficient dosing precision.

  • Dispense adhesive on antenna
  • Pick up component from wafer
  • Flip component
  • Place component on transfer station
  • Pick up component from transfer station
  • Align component to target structure
  • Place component on antenna
  • Bond component to antenna
Configuration for automatic RFID bonding
Automatic Die Handler DH6 including Flipping Unit
Dispensing Module
Vacuum Support Plate
Heated Pick and Place Tool
Heating Plate 100 x 100
Inspection Video Module VARIOPlus

The dispenser works with simple pressure time control. It is able to handle heat curing adhesive, it is easy to clean and provides sufficient dosing precision.

The Pico AMA is further equipped with a vacuum support plate for antenna array, allowing to handle several antennas on one substrate.

The software allows simple repetition as the same alignment procedure can be done at different positions with the need to teach the necessary parameters only once.

The wafer picker makes chip presentation easy. The dice are lifted by needles and picked up by a vacuum tool without affecting neighboured components.
Vacuum Support Plate

Automatic Die Handler

Vacuum Support Plate
The Pico AMA is further equipped with a vacuum support plate for antenna array, allowing to handle several antennas on one substrate.

The software allows simple repetition as the same alignment procedure can be done at different positions with the need to teach the necessary parameters only once.

The wafer picker makes chip presentation easy. The dice are lifted by needles and picked up by a vacuum tool without affecting neighboured components.
This could be of interest for you... back to top  
 
FINEPLACER® FEMTO - automatic sub micron OPTO-BONDER® (±0.5 micron)
FINEPLACER® Lambda - sub micron die bonder (±0.5 micron)
FINEPLACER® Pico MA - manual die bonder (5 micron)
FINEPLACER® Micro MA - manual die bonder (10 micron)
FINEPLACER® Pico AMA - automatic die bonder (5 micron)
FINEPLACER® Micro AMA - automatic die bonder (10 micron)

*the configuration shown on the picture may contain optional modules 
Click on the PDF icon to load the product flyer for:
FINEPLACER® Pico AMA
Click on the PDF icon to load the application note for:
Packaging Technologies of VCSEL
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Products | Micro Assembly Equipment | FINEPLACER® Pico AMA (Automatic Die Bonder)
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