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The modular platform system FINEPLACER® Pico AMA with a placement accuracy of 5 µm @ 3σ is an innovative automatic micro assembler that offers users extreme modularity and flexibility. It is ideal for the advanced placement and bonding of optoelectronic components, MEMS, multichip modules, sensors, RFID assembly and more. Numerous bonding technologies can be performed, the video shows automatic bonding of chips on glass (anisotropic conductive adhesives).
FINEPLACER® Pico AMA is perfectly suitable for automatic laser bar assembly. All steps of laser bar assembly can be carried out by the system - including batch recognition, handling and flipping of laser bar, transfer of submount or heatsink, bonding or soldering. The automatic vision aligment system eliminates the operator influence of the bonding result. After alignment and gentle placement of the laser bar the controlled Indium and AuSn soldering process starts (see process video).
