FINEPLACER® Lambda to Be Highlighted at SEMICON China 2007
FINETECH announces that it will display the FINEPLACER® Lambda in booth 2166 during the SEMICON China 2007 exhibition, scheduled to take place March 21-23, 2007 in Shanghai, China.
This high precision bonder provides a placement accuracy of ± 0.5 micron.
The manual version of the system is used for the most sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. The system can be equipped with different viewing equipment including a LEICA microscope or a camera-monitor magnification system.
A significant feature of the manual configuration is the FA7 heating plate, which offers the following benefits: 50 x 50 mm heating area; “high ramp rate,” programmable up to 20°C per second; excellent thermal conductivity; very low thermal expansion; programmable up to 400°C; and optional heated inert gas integration.
The motorized configuration of the FINEPLACER® Lambda provides auto-touchdown and die placement, as well as controlled bonding operation after manual alignment of die and substrate. Advantages of this version include hands-off die placement; improved process repeatability - pilot production worthy; placement of die with dimensions that exceed the optical field of view; up to 10 programmable microscope positions; upgradeable with integrated microscope measurement function and a placement mask generator.
Applications for the Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, and adhesive technologies. |
