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Micro Assembly Tools & ModulesThis chapter provides you with information about our spectrum of modules and tools for various applications within the field of micro assembly. |
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For prebonding transparent or opaque ACF cut outs after alignment of substrate and die. Includes an extra ACF prebonding head with vacuum holder and temperature controlled heater. The front face of the prebonding head is exchangable and thus can be adapted to the ACF's shape. |
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Flexible machine for full automatic die handling. Die pick-up from blue tape, flipping, and die transfer into multiple die presentations of various designs. Available as stand alone or OEM version (see picture) for integration into existing production lines. |
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Useful for any kind of die bonding process that uses bonding force, souch as thermo compression bonding, ACF bonding or ultrasonic bonding. Available as manual modules, generating the force by a lever-weight-system, or as fully motorized versions with electro pneumatical drives and PC control (needs software WinFlipChip). Forces from 0.1 N to 400 N are standard. |
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Needed for thermocompression die bonding, most times in combination with a heating plate and a bonding force module. Also useful for final bonding in case of ACF bonding process. Comes with one heated pick & placer tool, containing heater and thermal sensor. Offers controlled tool temperature and guides the bonding force to the die. |
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Clamped into the transducer of the ultrasonic module of the FINEPLACER®, die collets transfer the mechanical energy to the die. The length of the tool can be adapted to the die's thickness. The front face touching the die is available flat or pyramid shaped, depending on the application. |
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Used for rework or precise die attach, to dispense various viscous media (solder paste, underfiller, adhesive) on the PCB or substrate. Three degrees of freedom allow precise positioning relative to the substrate. Positioning and dispensing can be observed though the microscope or video equipment of the FINEPLACER® base system. Nearly any customary dispenser can be integrated. |
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Fixed at the positioning table, it is used to wetten balls or bumps with flux. Exchangable flux tray with depressions of different depths allow flexible dosing. |
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Clamped into the holding tracks of a (height adjustable) positioning table. Supports substrates and heats them from below. With integrated custom-made vacuum holder for the substrate. Powerful halogen heaters and integrated compressed air cooling allow excellent response to changes in the teperature's real value. Heated or unheated inert gas chambers available. |
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For FINEPLACER® Lambda and Pico. Heats the component from the top and guides the bonding force to the die. Heat and force are transferred to the chip via direct contact. Designed especially for thermocompression and ACF bonding. For reflow purposes, it may be used with hard or soft balls. For use with soft ball components a stop is available, z adjustable via micrometer screw. Preferably used together with a bonding force module. |
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Allows picking up a component directly from a foil using a placement arm and e.g. any pick&place tool. The stretched foil is fixed in a holder on the positioning table. The single dice are transfered to the tool by a needle that pierces the foil from below. |
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Necessary in any case where the substate cannot be clamped into the positioning table directly, e.g. when using a heating plate. Allow adjusting the top surface of any object to be bonded on in z direction, thus guaranteing the correct working level of the bonding area. This way, optimal parallelism between substrate and die can be kept under all circumstances. |
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The ultrasonic module comes with PC controlled auto tuning 20 W ultrosonic generator and transducer. Can be adapted to a lot of different die collets, just by one click inside the software WinFlipChip.Any time you want to use the ultrasonic bonding process, simply dismantle any pivot arm from your FINEPLACER® and replace it by the ultrasonic arm. |
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