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Rework Modules & ToolsThese items complete FINEPLACER® base systems to make them task-specific rework stations. FINEPLACER® systems can be enhanced with a multitude of different modules to be prepared for current and future rework challenges. |
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FINEPLACER® Modules & Tools |
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The new module allows the simultaneous placement of up to 200 solder balls directly onto a substrate. That FINETECH has been successfully able to place, solder and remove individual solder balls in relation to SMDs for years is fairly well known. |
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Allows reballing of desoldered but still functioning BGA, makes component reuse possible and thus saves costs. Fits into the FINEPLACER®s positioning table and works together with FINETECH's COMISS reflow module. Balls are poured into a customized template and reflowed on the BGA's interposer. |
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Powerful hot gas soldering system for assembling or reworking modern high pin count ICs on high density assembled boards. For base systems FINEPLACER® Jumbo, Micro and Pico. Goal-directed and narrowly limited heat input, combined with closed loop temperature provides perfect parameter control and thus optimal results with minimal stress to the component. |
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The rework future belongs to ever smaller components. Increasingly SMDs of the types QFN, MLF are used with contact areas directly attached to their bodies. Contact leads are not used at all to achieve, amongst others, higher component density on printed circuits boards. |
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Used for rework or precise die attach, to dispense various viscous media (solder paste, underfiller, adhesive) on the PCB or substrate. Three degrees of freedom allow precise positioning relative to the substrate. Positioning and dispensing can be observed though the microscope or video equipment of the FINEPLACER® base system. Nearly any customary dispenser can be integrated. |
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The new developed motorized pivot arm for the COMISS hot gas reflow module was introduced to the market, allowing an unrivalled degree of reproducibility in manual rework. |
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The Smart Component Sensor allows detecting vacuum at soldering heads over the partial vacuum range (normally 0 to -1000 mBar). |
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If repairs are needed, it is often necessary to put new solder paste on the PCB pads. Normal screen or stencil printing will not be possible because the area around the repair place is restricted. To overcome this problem, a new printing head for local and precise positioned paste dispensing was developed which can be inserted into the reflow arm like a soldering head. |
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Allows cleaning of the board's surface after the defective or wrongly placed component has been removed. In contrast to competing systems, all solder is removed with one single sweep. Works together with FINETECH's COMISS reflow module, see above. |
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Custom specific hot gas nozzles with lowest thermal mass. Working together with FINETECH's COMISS reflow module, they provide hot gas temperature curses following the desired values with excellent accuracy. Fitting into the reflow arm using a quick clamping divice, making tool change a job of a few seconds. |
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Protects personnel from inhaling hazardous substances emitted during the rework process. Fixed at the back side of the FINEPLACER®'s base plate, it holds two flexible arms with suction nozzles. Can be delivered for shop supplied exhaust vacuum or with own motor-filter-unit. |
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Thanks to the great flexibility it is possible to carry out the entire spectrum of the soldering technology including those with lead free solder. The soldering software WinCOMISS controls all functions of the FINEPLACER® SMD rework systems. Perfect control of all process parameters means superiority over competing systems: This gives optimal results with minimal stress to the component. Read more about the features |
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FINETECH Start Sensors serve to control and document your process under consideration of the board temperature. |
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The FINETECH Underboard Support is a usefull accessory for the work with large boards to prevent bending and twisting during the rework process. |
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