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Ultrasonic Module
Consists of a special pivot arm holding an ultrasonic transducer. The arm can be mounted instead of a standard placement arm, custom specified die collets hold the chips by a vacuum. After the placement procedure, the die collet transmits the mechanical energy from the ultrasonic transducer to the chip.
Collet is pyramid shaped inside to conduct the energy to the chip - a die collet is not included, please order separately. As this tool is always chip-specific, the exact chip dimensions length, width, and height are needed for manufacturing.
The Ultrasonic Module is designed for the use with all FINEPLACER® micro assembly systems. The ultrasonic transducer is fed by an autotuning power generator inside the control box delivering up to 20 W at a nominal frequency of about 60 kHz. In the new version of the ultrasonic module, all necessary parameters like ultrasonic power, ultrasonic duration and synchronized start time in relation to other process modules, are controlled via the WinFlipChip software FS4. Further, the calibration of the generator in relation to the tool can now be done automatically, just by clicking one button. This way, the generator can easily be adapted to work with different kinds of die collets. The ultrasonic module comes with a die collet length adjustment device - necessary to clamp the die collet at the correct length for ensuring optimal parallelism. |
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| Automatic Ultrasonic Bonding | |
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| The ultrasonic module extends the automatic machine's field of use for a variety of state of the art applications, such as photo diodes, SAW filters, RFID chips and many more. As usual, the placement arm can be exchanged against the ultrasonic arm, containing the ultrasonic transducer. As ultrasonic bonding requires especially low bonding forces, the ultrasonic arm can be equipped with an additional force sensor including cascade control circuit, offering a force range from 0.2 N to 20 N, at a resolution of 0.2 N. To compensate for Theta deviations, the ultrasonic module can rotate the die collet very precisely within an angular range of ±6°. |
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Die Collet
Die Collets are tools used for the ultrasonic module, made of extra hard Tungsten Carbide with low internal damping. Clamped into the transducer of the ultrasonic module of the FINEPLACER®, they transfer the mechanical energy from the transducer to the die. The length of the tool is adapted to the die's thickness by clamping it at the correct position.
The front face touching the die can be flat or pyramid shaped, depending on the application. If, e.g., an optical device with sensitive areas on top should be bonded, the pyramid design should be used, because it transfers the energy via the die's edges only. On the other hand, the flat design should be preferred in case of sensitive edges.
Together with the transducer, the die collet builds up an oscillating system, hold at its resonance frequency by the auto tuning ultrasonic generator. After tool change, it is sufficient to let the ultrasonic generator run one single calibration sweep. After that, the tool can be used immediately. | |
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