FINETECH to Present High-End Rework Systems at SMT 2008
Since last years SMT exhibition FINETECH has put a lot of effort into developing new application solutions for high end rework challenges to continue making a name for itself as a qualified partner for sophisticated rework tasks. Special attention was paid to the rework of smallest SMD components having been widely regarded irreparable in the past. On display will be applications like single ball reballing with ball sizes below 200 µm, µCSP, small passive rework down to 01005 as well as rework of underfilled components and leadless components (QFN, MLF).
For that reason FINETECH has further optimized the “Micro Rework” application package for FINEPLACER® Pico. The package includes all necessary tools and modules and marks an impressive enhancement of performance for the standard rework station. With optional motorization the system achieves a degree of reproducibility unrivaled in manual rework and minimizes operator influence. FINEPLACER® Pico is not only suitable for high-end rework applications but also capable of performing the whole range of standard rework tasks.
As of now, please feel invited to make individual demonstration appointments with the responsible FINETECH product and application managers during the SMT 2008. Exemplary process video samples can be watched at http:///www.finetech/enid/video.
At the SMT 2008, FINETECH is to present the whole spectrum of manual and fully automated FINEPLACER® rework stations for standard and high-end rework applications which are capable to perform all rework steps within one system. All FINEPLACER® systems are equipped with the unique Controlled Mix Soldering System (COMISS) allowing for an outstanding degree of process reproducibility.
The automatic FINEPLACER® Micro HVR is capable of flux and solder paste dispensing and is prepared to handle double-sided PCBs. Typical fields of application are automatic rework of RF shielded BGA or CSP, memory boards, LLC, TCOP or small passive components down to 01005. Representing a multitude of applications, FINETECH will demonstrate the automatic high volume rework of QFN components at the SMT 2008.
Compact rework station FINEPLACER® CRS10 is the perfect entry level model into the world of rework. The system offers high versatility and maximum performance for the complete range of standard rework applications. The simple “plug & go” concept allows quick setup and easy operation. CRS10 with a placement accuracy of 10 µm is ideal for small to medium size assembly or highly precise rework of soldered components on medium to large size SMD boards. The range of workable standard applications includes rework of BGA, CSP, QFN, MLF, QFP, TSOP, PLCC components, rework of SMD connectors, small passives or RF-shields and frames.
Visit FINETECH at the SMT 2008, booth # 9-341, in Nuremberg, Germany, starting from June 3rd to June 5th. Please find more information at http://www.finetech.de.
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