FINEPLACER® Micro AMA
Automatic Micro Assembly
The patented FINETECH platform with vision alignment system (VAS) forms the foundation for this automatic rework system. Based on a stationary beam splitter, the reliability of this working principle has been proven at several hundred installations worldwide.
A highly accurate and ”friction-free“ positioning table with x/y planar motor and high resolution z axis control is integrated. An additional fast linear axis enables large substrates to be accommodated, as well as a provision for component storage in trays or waffle paks. The FINETECH pivot arm with component rotation capability is automated for hands-free placement.
Sensors on the pivot arm allow component placement with defined force via z-axis motion of the substrate, providing a complete rework process including the patented ”single-sweep“ residual solder removal technique. All versions of the FINEPLACER® Micro AMA system have a placement accuracy of better than 10 µm, sufficient for the highest demands from large Super BGA down to µBGA, CSP and Flip Chip demands. |
