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Die Flip Module
The Die Flip Module allows flipping of even the most sensitive components which are on the "wrong" side (i.e. while pick-up from wafer, tray or gelpak) before transferring them to the pick & place tool in correct orientation.
The customer can choose between two different versions: the motorized Die Flip Module and the manual Die Flip Module. |
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| Motorized Die Flip Module | |
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The motorized Die Flip Module enables an additional automatic process step of flipping components between pick-up from wafer etc. and alignment/ placement.
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Technical Specifications |
| Power |
230 or 240 W, 50 or 60 Hz |
| additional |
110 or 130 V |
| Air Input |
6 bar, tolerance +1 / - 0.5 bar |
| Air Consumption |
24 standard litres/min at 6 bar |
| Air Purity |
according to DIN ISO 8573-1, Class 4 |
| Ambient Temperature |
15°C - 40°C |
Benefits:
- automatic die flipping
- easy synchronized process integration
- no loss of throughput
- safe vacuum-based handling of sensitive components
- comfortable control via "WinFlipChip" bonding software
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The manual Die Flip Module is a rotatable device providing an economic solution when a die presented to a FINEPLACER® needs to be flipped before it can be placed and bonded. |
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