Rework Applications:

Contactless Solder Removal Learn more about contactless solder removal solutions for safe and careful site dressing.

PoP / BGA Rework Get more information about hot gas rework technology for Package on Package or BGA components.

QFN Rework Read more about our "All in One" rework solution for QFN and MLF components.

Overview Rework Equipment

Video Microscope Workstation

Opto Bonding & Micro Assembly:

Laser Bar Bonding Read more about our solutions for bonding of laser bars / single lasers.

FlipChip Bonding  Learn more about FlipChip bonding, RFID Assembly and the high precision FINEPLACER® platform.

RFID Assembly Get more information about this new application for the FINEPLACER® systems, used for R&D and pre-series RFID production.

Overview Flip Chip Bonder Equipment

Automatic Sub-Micron Flip Chip Bonder

Company Profile

Take 3 minutes to learn more about FINETECH flip chip bonder and rework equipment.

Trade Shows

Jul 14 - 16, 2009 Semicon West 2009 San Francisco, CA Sep 06 - 09, 2009 CIOE 2009 Shenzhen, China Sep 21 - 23, 2009 ECOC 2009 Vienna, Austria Sep 30 - Oct 02, 2009 Semicon Taiwan 2009 Taipei, Taiwan  Oct 06 - 07, 2009 SMTAI San Diego, California

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