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Manual Bonding Force Module
Supporting Flip Chip Bonding. Suitable for different bonding technologies, e.g. thermo compression, or processes using conductive adhesive. Also suitable for ultrasonic or thermo sonic. Depending on the demands of the application there are manual and automatic modules to choose. |
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- One-handed operation for lowering the pivot arm and applying force
- Application of bonding force by lever-shaft force transmission using a separate force arm, continuously adjustable by sliding weight, force range and resolution; see technical specification.
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| Code |
Min. Force (N) |
Max. Force (N) |
Resolution (N) |
Lambda |
Pico |
Micro |
Jumbo |
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FD3.1 |
0.1 |
20 |
0.1 |
• |
• |
• |
• |
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FD3.2 |
1 |
40 |
1 |
• |
• |
• |
- |
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FD3.3 |
2 |
100 |
3 |
• |
• |
• |
- |
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FD3.4 |
20 |
200 |
5 |
• |
• |
• |
- |
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FD3.5 |
40 |
400 |
10 |
• |
• |
- |
- | |
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Motorized Bonding Force Module
The new improved version of the motorized bonding force module is now equipped with closed loop force control, offering an even better accuracy of the force setting, excellent repeatability, smoother arm movement and force application, as well as enhanced controllability via PC.
This Module needs the WINDOWS® software "WinFlipChip", offering an extra register card where all significant parameters like force, time and temperature can be set within the time graph of the bonding process. This guarantees an coordinated operation in accordance to the temperature/time course of the other PC controlled process modules, e.g. Heated Pick and Place Tool, Ultrasonic Module or Heating Plates. Arm movement and application of bonding force can be triggered time or temperature controlled. The real value of the temperature may be derived from the sensor inside the heated pick and-place tool as well as from any external thermocouple. The behaviour of the bonding force module can be adapted to different pivot arms for placement or ultrasonic application, just by changing the software setting.
The motorized bonding force module for the FINEPLACER® Lambda (A6) base module is only available in combination with the motorized camera movement. |
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- Force and time adjustable by PC
- Synchronous operation with other "µC" modules
- Bonding process controlled by PC software
- Dependent on either temperature or time
- Self-propelled placer arm movements
- Gentle touch down, then application of force
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Motorized Bonding Force Modules with one range...
| Code |
Min. Force (N) |
Max. Force (N) |
Resolution (N) |
Pico |
Micro |
Code |
Lambda |
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FD5.0 |
0.3 |
30 |
0.3 |
• |
• |
FD5.0SHM* |
• |
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FD5.1 |
0.5 |
50 |
0.6 |
• |
(•) |
FD5.1SHM* |
• |
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FD5.2 |
1 |
100 |
1 |
• |
(•) |
FD5.2SHM* |
• |
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FD5.3 |
2 |
200 |
2 |
• |
- |
FD5.3SHM* |
• |
Motorized Bonding Force Modules with two ranges...
| Code |
Min. Force (N) |
Max. Force (N) |
Resolution (N) |
Pico |
Micro |
Code |
Lambda |
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- |
0.1 |
2.5 |
0.05 |
- |
- |
FD6.SHM* |
• |
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- |
2.5 |
10 |
0.2 |
- |
- |
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• |
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FD7 |
0.3 |
30 |
0.3 |
(•) |
• |
FD7.SHM* |
• |
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4 |
400 |
4 |
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• | • available (•) available, but not recommended - not available
* for FINEPLACER® Lambda always including motorized microscope shifting ("SHM") |
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Technical Specifications |
| Voltage |
230 V, 110 V, 100 V; 50 Hz or 60 Hz |
| Max. Power Consumption |
150 W |
| Fuse |
1 A (slow reacting) , 250 V |
| Air Input |
6 bar, tolerance: +1 bar, -0.5 bar |
| Air Consumption |
0.5 standard liters per minute at 6 bar |
| Air Purity |
Particles, water and oil content according to DIN ISO 8573-1, Class 4 |
| Surrounding Temperature |
15 °C ... 40 °C |
| Dimensions of control box |
310 mm x 290 mm x 155 mm |
| Weight of control box |
about 7.9 kg | |
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WinFlipChip - Bonding Software
FlipChip bonding processes using FINEPLACER® equipment may optionally be software controlled, using PC controllable modules supplied by FINETECH.
Temperature profiles are continuously adjustable, with separate settings for working and standby temperatures. You may work under time or temperature control. In trial runs, all parameters and graphs are compressed and stored on the hard disk. During production, they can easily be recalled ensuring a repeatable process. If required, the control can be run by mouse only, without using the keyboard.
The bonding software WinFlipChip can be used for:
- Easy generating, storing and recall of the parameters for optimum bonding process
- Viewing, storage and printing (ISO 9000) of temperature-time graphs
- Managing an external thermocouple
- Corresponding with a frame grabber (video on computer monitor)
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- Storage of optimum bonding parameters and programs
- Real-time representation of the temperature-time progress on the monitor
- Representation of the real joint temperature by an optional external thermocouple, connected to FB... control box and positioned as needed S
- toring of process parameters and temperature-time graphs of the 3 measuring points (Heated Pick-And-Place Tool, chip or other useful point, as well as heating plate) may be stored, recalled, and printed for process documentation
- Each section contains one heating/cooling ramp with adjustable steepness, followed by a period of constant temperature.
The software can control the following modules:
Heating plates
Chip Contact Heating Module
Bonding Force Module
Ultrasonic Module |
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