Heated Pick & Place Tool

This tool can be used at the FINEPLACER^® Lambda and Pico, and heats the component from the top, at the same time guiding the bonding force from the placement arm to the die. In contrast to the principle used in hot gas soldering heads, heat and force are transferred to the chip via direct contact. The heat is generated inside the tool by an electric heater. The temperature is measured via an internal sensor and electronically controlled by the chip contact heating module.

Heated pick & place tools are especially designed for thermo compression or ACF processes. They may, however, be used for reflow purposes, too. In this case, balls with hard core should be prefered. If dice with soft balls have to be soldered anyhow, the placement arm should be equipped with a mechanical stop for its z movement downwards. This measure will avoid pancaking of the liquefied solder bumps by the weight of placement arm and tool. FINETECH delivers a stop which can be adjusted using a micrometer screw.

The tool's length and front face shape are adapted to the die to be bonded. To enhance the range of use for various die thicknesses, spacers should be used to change the effective tool length.

A ball bearing with optimized center position for compensating die skewness may be integrated into the tools.

The heated pick & place tool is used together with FINETECH's chip contact heating module.