Manual Die Pick-Up Module

This module can be retrofitted to the FINEPLACER^® models Pico and Lambda (only 6" version) and allows picking up a component with a placement head directly from a foil (blue tape). After that, it can immediately be placed on the substrate with high accuracy.

For picking up the component, this is aligned to the placement head and the pivot arm is put into its horizontal position. After that, the die is transferred to the placement head, heated pick-and-place tool or die collet. For this, one or more needles pierce the foil and lift the chip until it touches the tool, where it is hold by vacuum. This way, it becomes unnecessary to pick up chips from the foil manually and assort them into a tray or waffle pack.

Optionally it is possible to preadjust the sawed wafer to the substrate in x and y direction, ensuring a row and column oriented assignment between die and substrate.