What is a BGA?

BGA means Ball Grid Array. A BGA cosists of a small thin PCB, called interposer, and the electrical circuit as a silicon die mounted on its top side and covered by a plastic case. On the interposer's underside is a grid array of solder balls. The interposer contains conducting paths and vias that connect the contacts of the die to the solder balls.

BGA usually don't need additional solder to be attached and electrically connected to the PCB. During reflow the solder balls are recasted and transfered into diabolo shaped columns connecting the pads on the PCB to those on the interposer. This way matching tolerances and warpage may be compensated by slight height variations of the single columns.

BGA's are reworkable components. Defective ones or such that are soldered in the wrong way round by mistake can be reworked by using any FINEPLACER^® rework station, e.g. a JUMBO, MICRO, PICO or CRS. If larger amounts of PCB with the same defect have to be repaired, an automatic rework station FINEPLACER^® Micro HVR maybe useful.

FINEPLACER^® Pico RS (modular rework system for smallest components and mobile devices)
FINEPLACER^® Micro RS (modular rework system for advanced and standard rework)
FINEPLACER^® Micro HVR (automatic rework station for advanced and standard rework)
FINEPLACER^® CRS (compact rework system for advanced and standard rework)
FINEPLACER^® Jumbo (modular rework system for very large board sizes)
FINEPLACER^® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications)

^{*the configuration shown on the picture may contain optional modules}