Basic Study on the Use of Lead-free Solder Materials in the Rework Process

Dipl.-Ing. Rüdiger Holzmann
Nordostpark 91
D-90411 Nürnberg
Tel.: +49(0)91158058-15
Fax.: +49(0)91158058-30

In collaboration with:

F A P S - T T GmbH
Technologietransfer zu
Fertigungsautomatisierung
und Produktionssystematik
Prof. Dr.-Ing. Klaus Feldmann
e-mail: feldmann@faps-tt.de

FINETECH GmbH & Co. KG
Wolfener Str. 32/34 Haus L
12681 Berlin
Tel.:+49 (0)30 936681-0
Fax:+49 (0)30 936681-44
e-mail: finetech@finetech.de

1 Technological Basics in Applying Paste

   1.1 Quality Aspects of Rework in Fine Structures and Alternative Connecting Mediums

   1.2 Technological Differences of Bringing in Heat

2 Rework Process with Alternative Soldering Mediums

   2.1 Examination Scope of the Study

   2.2 Temperature Profiling for Lead-free Connecting Mediums

   2.3 Evaluation of the Use of Nitrogen in Rework

3 Total Evaluation of Rework

   3.1 Evaluation of the Process Variant in Rework 

   3.2 Long Term Reliability of Reworked Connection Points 

Literature