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Packaging Technologies of VCSELVCSEL (vertical-cavity surface-emitting laser) are a special type of semiconductor laser diodes with the laser beam emitting perpendicular from the top surface. In contrast to edge-emitting laser laser diodes, VCSEL can be tested at different stages of the production and assembly process. This enables to check for material and processing failures and to drastically improve yield.
Benefits:
- low production costs
- low power consumption
- can be tested on-wafer during the production process
- large laser output aperture, low divergence angle
- tunable wavelength (according to thickness of reflector layers)
- VCSEL design allows dense assembly in 1-dimensional and 2-dimensional arrays
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Flip Chip (face down) |
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Solder: AuSn 80/20, TS 285°C
Substrate: Au Pad
Atmosphere: N2 or N2-H295/5
Bonding force: app. 0.25N/Bump |
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| Thermocompression Bonding | |
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Bumps: e.g. Au Stud, Tb 350°C
Substrate: Au Pad
Atmosphere: opt. N2
Bonding force: app. 0.5-0.8 N |
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Bumps: e.g. Au Stud, Tb 100°C
Substrate: Au Pad
Atmosphere: opt. N2
Bonding force: app. 0.25 N/Bump |
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Precise VCSEL Attach (face up) |
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| Step 2: Adhesive Transfer | |
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| Step 4: Temperature Curing | |
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Glue: e.g. silver epoxy
Curing temperature: e.g. 150°C
Bonding force: app. 0.15 N/mm2 |
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Due to its outstanding placement accuracy of ± 0.5 µm FINEPLACER® FEMTO is perfectly suitable for even the most sophisticated micro assembly applications.
Due to the high process flexibility, FEMTO is capable to employ different process gases like nitrogen, inert gas and formic acid. With its open system architecture, FINEPLACER® FEMTO can be easily adapted with specific additional modules which allow an outstanding multitude of applications and processes. The spectrum ranges from power laser and laser bar bonding, flip chip and VCSEL bonding over assembly of MEMs and MOEMs, sensors or micro-optics to chip on glass or surface mount photonics.
FEMTO is capable to perform both AuSn and Indium bonding
More information on FINEPLACER® FEMTO. |
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The manual high accuracy sub-micron flip chip bonder FINEPLACER® Lambda with a placement accuracy of up to ± 0.5 µm is capable of various indium and AuSn applications.
Preferred applications for the versatile FINEPLACER® Lambda system are assembly of opto-electronic components (e.g. VCSEL, photo diodes, power and single lasers or laser bars), advanced device packaging (MEMS, sensors, micro-optics, embedded components, surface mount photonics), flip chip bonding and precise die attach. The motorized configuration provides auto-touchdown and die placement also for components which exceeds the optical field of view, very high process reproducibility and up to 10 programmable camera positions. Lambda can be upgraded with a placement mask generator. The optional integration of heated inert gas or formic acid is possible.
More information on FINEPLACER® Lambda. |
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FINEPLACER® Pico AMA is an innovative automatic micro assembler for production environments that offers users extreme modularity and flexibility. Because the system is based on a modular platform, it offers a high range of flexibility and can be applied to a wide application range. Additionally, the ability to upgrade and retrofit provides significant cost benefits to users - it provides an “all in one” cost-saving solution.
With a high placement accuracy of 5 µm @ 3 σ, the FINEPLACER® Pico AMA is ideal for the advanced placement and bonding of VCSEL and other optoelectronic components, MEMS, multichip modules, sensors, RFID assembly, and more. The system is versatile for many bonding techniques, including flip chip (thermocompression, ultrasonic, and soldering), dispensing, UV curing, fluxing and ACP.
More information on FINEPLACER® Pico AMA |
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Click on the PDF icon to load the application note for:
Packaging Technologies of VCSEL |
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