FINEPLACER® Micro MA
Multipurpose Bonding Platform
The FINEPLACER® Micro MA can be used in a wide field of applications. The machine shown at right is a motorized thermocompression die bonder with an optional die picking module for wafer frames.
The Micro MA offers high accuracy [10 µm (0.4 mil) placement accuracy], allowing the capability to bond the smallest die with a pitch of down to 50 µm. Compared to the Pico MA, this system offers an enlarged working space. Therefore, it can be used with wafers up to 8" diameter, with full access to each die.
Typical fields of application are:
- RFID assembly
- Sensor assembly
- Chip on flex
- Embedded components
- LED bonding
- Chip to wafer bonding (8'')
All established micro assembly methods can be handled, including:
- Die attach
- FlipChip bonding
- Soldering (AuSn, Indium)
- Thermocompression
- Ultra-/thermosonic
- C4 soldering
-ACF/ACP/NCP
- Curing
- UV
- Temperature
FINETECH keeps pace with the newest technical developments, resulting in continuous upgrading of existing features and development of updated process modules.
Benefits:
- Multipurpose platform for micro assembly and rework applications (upgradable for hot gas)
- Patented vision alignment system ensures placement accuracy better than 10 µm
- Large field of view and working area
- Live process observation
- Stable and compact system with minimal number of moving parts
- High resolution vision with fiber optic lighting
- Sophisticated FlipChip bonding software
- Software-controlled processing
- High level of flexibility
- Easy adaptable to various applications
- Designed for pre-series production, process & product development
- Optional motorized bonding force module
- Ready for sophisticated future technologies
- Low cost of ownership
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