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FINETECH to Present Solutions for the Latest Advanced Packaging Trends on SMT 2008
FINETECH, a leading German manufacturer of innovative rework and micro assembly equipment, is to present equipment solutions for the latest advanced packaging trends at the SMT 2008 exhibition. Out of the award-winning FINEPLACER® bonding systems, the automatic sub-micron opto-bonder FINEPLACER® FEMTO and the versatile sub-micron bonding system FINEPLACER® Lambda will be on display with various AuSn and Indium processes.
Automatic die bonder FINEPLACER® FEMTO has been further optimized for the most sophisticated bonding applications. Due to the high process flexibility, FEMTO is capable to employ different process gases like nitrogen and formic acid. The system marks a breakthrough by combining high placement accuracy of ± 0,5 µm), large working area (maximum die size up to 4” diameter, substrate size up to 6” diameter) and process flexibility within an automated bonding system capable of handling various assembly technologies.
The newly developed high speed bottom heater for FEMTO is suitable for the AuSn process and was especially developed for small components (integrated 2 inch tray holder) with sensitive structures and strong time demands. Features are temperatures up to 400°C, a max. temperature ramp of 100°K/s and capability of rapid cooling. Other FINEPLACER® bonding systems can also be equipped with this high speed heater.
With its open system architecture, FINEPLACER® FEMTO can be easily adapted with specific additional modules which allow an outstanding multitude of applications and processes. The spectrum ranges from power laser and laser bar bonding, flip chip and VCSEL bonding over assembly of MEMs and MOEMs, sensors or micro-optics to chip on glass or surface mount photonics.
FINEPLACER® FEMTO is designed for both a production environment as well as for process/product development.
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High accuracy sub-micron flip chip bonder FINEPLACER® Lambda is FINETECHs most versatile FINEPLACER® system.
Preferred applications for FINEPLACER® Lambda are assembly of opto-electronic components (e.g. VCSEL, photo diodes, power and single lasers or laser bars), advanced device packaging (MEMS, sensors, micro-optics, embedded components, surface mount photonics), flip chip bonding and precise die attach. The system is capable of both AuSn and indium bonding processes. The motorized configuration provides auto-touchdown and die placement also for components which exceeds the optical field of view, very high process reproducibility and up to 10 programmable camera positions. Lambda can be upgraded with a placement mask generator. The optional integration of heated inert gas and formic acid is possible.
Offering a placement accuracy of ± 0,5 µm, FINEPLACER® Lambda is also available in manual configuration and can be used for the most sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. The system can be equipped with different viewing equipment.
FINEPLACER® Lambda is characterized by low cost of ownership and is especially suitable for low volume production, R&D or universities.
Visit FINETECH on booth # 9-341 at the SMT 2008 in Nuremberg, Germany from June 3rd to June 5th, 2008. Find out more about FINETECH at http://www.finetech.de.
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