The brand new FINEPLACER® FEMTO provides auto-touchdown and die placement as well as controlled bonding operation after automatic alignment of die and substrate. FINEPLACER® FEMTO is an innovative opto-bonder that offers users extreme modularity, large flexibility and high placement accuracy of ±0.5 µm.
FINETECH's most precise manual base module. For all kinds of device bonding where the placement error must be kept to an absolute minimum. Very suitable for Opto Bonding, Flip Chip Bonding and Micro Electro Mechanics (MEMS) placement. The most flexible system offers excellent accuracy (± 0.5 µm placement accuracy) at a competetive price.
Automatic Die Bonder for placement and bonding of components. Picture processing, self propelled positioning table and placement arm as well as automatic force generation allow placement lots of equal components continuously. Standard and custom specific tools available. Offers very high accuracy (5 µm @ 3 σ).
FINETECH's most versatile base module. Can be used in a wide field of application for rework (Pico RS) and different kinds of micro assembly, e.g. Flip Chip bonding processes (Pico MA). Offers very high accuracy (5 µm placement accuracy), as well as maximum flexibility. The picture shows a FC bonding configuration.
The Micro MA offers better than 10 µm placement accuracy, allowing to bond smallest dice with a pitch of down to 50 µm. Compared to the Pico MA, the machine offers an enlarged working space and therefore it can be used with wafers up to 10" diameter, with full access to each die.
