The new module allows the simultaneous placement of up to 200 solder balls directly onto a substrate.
That FINETECH has been successfully able to place, solder and remove individual solder balls in relation to SMDs for years is fairly well known.
New is the simultaneous high precision placement of up to 200 solder balls directly onto a substrate or wafer that can be up to 12 inches across.
The new Ball Array Placement Module (BAP-Module) for the FINEPLACER® allows the defined provision and transfer of flux in a first step and as a second step the pick up and transfer of several solder balls unto a substrate at the same time.
Ingenious vacuum control of the BAP-Module guarantees secure pick up and handling and deformation free placement of the balls. Using the patented FINEPLACER® Vision Alignment System and high resolution video optics the balls are placed very accurately. The Bondforce Module provides precise control over the forces used during the whole of the pick up and placement process.
As a logical augmentation the BAP-Module further extends the use of the FINEPLACER® Platform. Older systems, too, can easily be retro fitted with this new module. |
