This module is used for site dressing after the removal of SMD components (BGA, mini BGA, PoP, CSP, Flip Chips or Small Passives). It is also suitable for cleaning BGA interposers before reballing with the Reballing Module. The Solder Removal Module works together with the COMISS Top Heating System.
A solder removal head fits into the reflow arm to be heated up by COMISS like a Soldering Head. The module can be equipped with variably designed solder removal heads. The design of the head follows the demands of the board or component specification.
By using the micrometer screws of a manual rework systems the solder of small components like mini BGA can be removed very accurately without disturbing neighbored components. For large component the air cushion from the positioning table can be used. Automated systems are using the motorized positioning table for reproducible solder removal results.
Residual solder removal in one single sweep: after starting a reflow process the molten solder can be removed easily from the board due to the powerful vacuum of the module. The new generation of solder removal heads allow contactless residual solder removal without any disturbing influence on pads or solder resist. See the video to learn more about contactless residual solder removal of a BGA 35x35 mm.
"Twin Power" Solder Removal Head
An accurate residual solder removal is an essential factor of success for most rework applications. However, increasing packing density and ever shrinking sizes of SMD components make it more and more difficult to get sufficient access to the component site. Manual residual solder removals hold the risk of damaging solder resist or PCB tracks which could result in a defective board. Therefore, FINETECH offers nozzles for contactless solder removal which allow safe and careful cleansing even of very small sites on heavily populated boards. Adjacent components and the PCB will be protected reliably from damage.
Due to strong demand this contactless solder removal procedure now has been adapted to the requirements of the rework of large components. It was necessary to modify the existing solder removal module and to develop special solder removal tools with an increased flow rate. The new "Twin Power" Solder Removal Head with dual chamber system now is the best contactless solder removal choice for large SMD components of 35 mm edge length. Nozzles for even bigger component dimensions can be offered by request.
By providing constant suction power over the whole width of the site and combined with precise heat management, the "Twin Power" Solder Removal Head can quickly and reliably remove liquid solder in a single sweep. Stress to the component will be reduced to an absolute minimum.
With the addition of the new "Twin Power" Solder Removal Head to the line-up FINETECH is offering quick and reliable solder removal solution for virtually all SMD component sizes in the market!
Parts of the Solder Removal Module
Technical Specifications
Module component
Part No.
Remark
Solder Removal Control Box
with Venturi and vacuum meter (air consumption 100 l/min at 6 bar), air purity according to DIN ISO 8573-1, Class 4
Layout Specific Solder Removal Head
RC4.H
to suck residual solder off the pads in a limited PCB area
FINEPLACER® Pico RS (modular rework system for smallest components and mobile devices) FINEPLACER® Micro RS (modular rework system for advanced and standard rework) FINEPLACER® Micro HVR (automatic rework station for advanced and standard rework) FINEPLACER® CRS (compact rework system for advanced and standard rework) FINEPLACER® Jumbo (modular rework system for very large board sizes) FINEPLACER® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications) *the configuration shown on the picture may contain optional modules
