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High Value ReworkUsing automation, high volume rework can be transformed into high value rework where typical “expense” operation becomes an “income” business segment.
A rework process usually undoes some type of error — either human or machine-generated. While the operation may recover costs, it adds to product expense and directly or indirectly reduces margin. Such rework operations are traditionally manual and sometimes are done without the aid of even a manual rework tool.
The notion of “automated” rework begs the question, “Why not just fix the original problem in the first place?” This is not always possible. Under what circumstances does automation play a role in rework? The answer may simply be when hundreds or thousands of the same part need to be repaired. Such errors, if due to assembly, quite often are caught during the process. But a whole new level of rework arises when:
- Component failure is discovered too late
- High-value products require revisions
- Design defects go unnoticed until the end user experiences them
- Re-engineering change orders can revive a once-obsolete product
- Firmware updates require the change of only a single die to reuse a product.
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These tasks require a rework operation specifically designed to repair/replace components in volume, where yield becomes a function of the rework process, not just the steps that precede it. The answer is an automated rework process: a programmed sequence of repair steps including defective component de-solder and discard, residual solder removal, component placement, and re-solder. Since all steps are performed without operator intervention, the process is precise and the quality consistent. Vision alignment is critical, as is the ability to take in data maps to identify package(s) to be reworked.
In addition to the above, certain industries or applications may require extra rework steps. Handheld electronic devices may involve shield-can removal/replacement operations. Passive devices (0201 and smaller) must be accompanied by the ability to dispense solder paste in small quantities. With elevated temperatures needed for lead-free work, the rework equipment must be capable of working for extended periods of time at temperatures typically 30º to 50ºC above SnPb eutectic reflow temperatures.
Today’s 0201 components often are located in a densely populated area of a PCB or module. The rework process must be accomplished not only in a precise manner for placement, but also in an exacting thermal manner to reflow solder for component removal and replacement. Surrounding components must not be disturbed, or additional defects will be created. Since more advanced technology is necessary to rework passive devices, equipment with high placement precision (in the order of 5 to 10 µm) is emerging, as well as automated systems.
Until recently, rework has been a singular problem — fix the board and move on. But with the advent of high-value boards and products, a new rework approach is mandated. Equipment suppliers recognize these challenges by engineering solutions and developing tools that address high-volume rework requirements, thus allowing manufacturers an opportunity to create a new value and income market segment. |
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High Value Rework |
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