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Pico MA with side dispenser moduleZoom FINEPLACER® Pico MA*

FINEPLACER® Pico MA
Multipurpose Bonding Platform

The FINEPLACER® Pico is FINETECH's most versatile base module. It can be used in a wide field of application for reflow/rework (Pico Rework Station) and different kinds of micro assembly, e.g. Flip Chip and Die bonding (Pico Micro Assembly).

On one hand, the Pico MA offers highest accuracy [5 µm (0.2 mil) placement accuracy], allowing bonding of the smallest die with a pitch of down to 50 µm. The machine is capable of reworking all types of SMT components (BGA, QFN, connectors, QFP, SOIC, etc.).

All established reflow and bonding methods can be executed. Moreover, FINETECH keeps pace with new technical developments, resulting in continuous upgrading of existing features and development of most up to date new process modules.

 
Benefits:
  • High placement accuracy < 5 µm
  • Patented vision alignment system 
  • Compact design with minimum numbers of moving parts
  • High level of flexibility due to modular concept
  • Fibre optics illumination
  • Graphical user interface based on Windows XP 
  • Designed for process & product development
  • Optional semi-automatic configuration
  • Ready for sophisticated future technologies
  • Low cost of ownership
  • Multipurpose platform for micro assembly and rework applications (upgradeable with hot gas)

To equip the base system PICO as a flip chip bonder, the following process modules are necessary:

To view the process via a video monitor, the following video module can be used:

Technical Specifications & Optional Modules back to top  
 
Technical Specifications
Placement Accuracy:
better than 5 µm
Max. Board Size:
410 mm x 234 mm
Chip Sizes:
0.2 mm up to  85 mm1
Bonding Force:
min. 0.1 N max. 500 N 
Total Magnification:
up to 230 x
1 optional with Video Shifting Module
Optional Modules
Bonding Force Module (manual, motorized)
Chip Contact Heating Module
Ultrasonic Module
Sonic VOID Reducer
Die Pick-Up Module
Die Flip Module
ACF Module
LEICA Zoom Microscope
Microscope / Video Shifting Module
Coaxial Illumination
Alignment Mask Generator
Dispensing Module
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FINEPLACER® Pico MA - manual die bonder (5 micron)
FINEPLACER® Micro MA - manual die bonder (10 micron)
FINEPLACER® Pico AMA - automatic die bonder (5 micron)
FINEPLACER® Micro AMA - automatic die bonder (10 micron)

*the configuration shown on the picture may contain optional modules 
Click on the PDF icon to load the product flyer for:
FINEPLACER® Pico MA
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Products | Micro Assembly Equipment | FINEPLACER® Pico MA (Flip_Chip_Die_Bonder)
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