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Product & Press InformationWe are driven by continuous innovation. Our aim is to be the best manufacturer in rework and bonding equipment. That's why we are dedicated to improve existing solutions as well as to design new products to keep pace with new developments on the market. Read more about our latest products: |
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Flat packages such as QFNs (Quad Flat No-lead) or other MLFs (Micro Lead Frame) with outstanding thermal, inductive and capacitive characteristics are being increasingly incorporated into denseöy populated, space-saving assemblies. Unlike BGA components, QFNs however do not provide... |
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Since last years SMT exhibition FINETECH has put a lot of effort into developing new application solutions for high end rework challenges to continue making a name for itself as a qualified partner for sophisticated rework tasks. Special attention was paid to the rework of smallest SMD components having been widely regarded irreparable in the past. On display will be applications like single ball reballing with ball sizes below 200 µm, µCSP, small passive rework down to 01005 as well as rework of underfilled components and leadless components (QFN, MLF). |
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FINETECH, a leading German manufacturer of innovative rework and micro assembly equipment, is to present equipment solutions for the latest advanced packaging trends at the SMT 2008 exhibition. Out of the award-winning FINEPLACER® bonding systems, the automatic sub-micron opto-bonder FINEPLACER® FEMTO and the versatile sub-micron bonding system FINEPLACER® Lambda will be on display with various AuSn and Indium processes. |
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Company News October 2007 |
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At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present new product solutions, i.e. the the Video Microscope Workstation FINEVIEW, new LED lighting solutions and the infrared start sensor. |
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On September 27th, 2007, FINETECH was delighted to welcome industry representatives from all over to world to the 4th International User Meeting 2007 in Berlin. The User Meeting is an annual event bringing together FINETECH customers, external specialists and representatives to discuss the latest trends in the fields of rework and micro assembly. |
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Offering innovative equipment solutions for most rework or micro assembly challenges, FINETECH presents its new application package “Micro Rework” for the FINEPLACER® Pico. In a world of ever smaller components, “Micro Rework” is committed to rework applications e.g. single ball repair, µCSP or small passives like 01005. |
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The FINEPLACER® FEMTO is the new member of the awarded FINEPLACER® family - an automated bonding platform capable of handling complex high-precision applications in the fields of micro- and opto-assembly... |
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FINETECH announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for the FINEPLACER® Pico AMA Automatic Micro Assembler. The crystal glass award was presented by Global SMT & Packaging Magazine’s Publisher and Editor-in-Chief to General Manager Chris Underhill during a Wednesday, September 27, 2006 ceremony that took place at the Sofitel Hotel during the Assembly Technology Exposition. |
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To coincide with the deadline for the introduction of Lead Free materials, FINETECH has created a new version of their soldering software WinCOMISS. Many new functions have been added, particularly those useful for processing Lead Free materials.
The newly integrated Profile Library offers more than 200 proven soldering profiles. These can be very quickly adjusted to individual boards and components with a Drag & Drop function. Compared to automatically generated profiles, this method ensures significantly more reliability in the rework process. The processes are machine independent and can be transferred to other FINEPLACER® systems with reproducible results. |
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The SMT show will see the introduction of the newest addition to the FINETECH product range which allows the simultaneous placement of up to 200 solder balls directly onto a substrate. That FINETECH has been successfully able to place, solder and remove individual solder balls in relation to SMDs for years is fairly well known. |
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