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Learn more about Lead Free Rework

The "Green" electronics movement is truly a worldwide phenomenon. On July 1st, 2006, the European Union will begin restricting the material content of electronic products being shipped within and into the EU. There are several elements and compounds affected (see table below). The most common is lead (Pb). “Lead-free” it is not just an issue in Europe and companies cannot wait until 2006 to get started. Materials suppliers are shipping lead-free products today, and competitors are preparing for the transition now. In this dynamic environment FINETECH is fully committed, and prepared to meet the customer's needs.

Below you will find information about solutions for your lead free application. If you need more details and support please contact our sales team or contact a FINETECH sales representative responsible for your region.

 

Complete Rework CycleZoom
Complete Lead Free Rework Cycle
Partial List of Banned Substances
Lead Pb
Mercury Hg
Cadmium Cd
Hexavalent Chromium Cr+6
Poly brominated biphenyls PBB
Poly brominated diphenyl ethers PBDE

Process Challenges

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  • Solder where lead is substituted by other materials (Bi, Cu, Ag, …) needs high accurate control of reflow parameters
    • Melting point app. 30K "above lead" and reflow temperatures 30–50K above liquidous temperatures increases the heat load of components and boards
  • Precise process control
    • Reflow with fast heating and cooling capability
    • Separate control of top and bottom heater
    • Real time control of heat transfer
    • Reflow in controlled inert atmosphere
    • Increased demand of heat necessary
  • Reduced component self alignment effect
  • New solutions of solder paste transfer technology
  • Different flow characterisic of lead free solder paste
  • Opt. BGA, CSP-Reballing Module
 JEDEC recommended profile ( IPC / JEDEC J-STD-020B )
COMISS real time graph for lead free rework
The main characteristics of lead free solders are reduced self alignment and wetting effect, as well as higher melting temperature. This results in a smaller process window. JEDEC recommends a specific soldering profile taking the above properties into account. The Controlled Mix Soldering System (COMISS) - part of the FINEPLACER® System - offers the technical know how to cope with the JEDEC requirements.
FINETECH’s solutions back to top  
 
FINETECH recommends the following modules for safe and reproducible results:
  • Placement accuracy better than 10 microns (FINEPLACER® Micro)
  • COntrolled MIx Soldering System - COMISS reflow module
    • Multisection capability for top and bottom heating
    • Real time controlled heat transfer (temperature and air flow)
    • Temperature ramp steepness 1...50K/s
    • Controlled cooling capability
    • Board temperature sensor
    • Programmable switching between air and process gas (nitrogen)
    • Nearly without inertia
  • Advanced paste transfer technology, component printing, solder paste dispensing
  • Minimizing the time period above melting point and the heat load of components and board by fast and accurate process control
  • Soldering heads with low thermal mass for every component design
Related Products back to top
 

FINEPLACER® Pico RS (modular rework system for smallest components and mobile devices)
FINEPLACER® Micro RS (modular rework system for advanced and standard rework)
FINEPLACER® Micro HVR (automatic rework station for advanced and standard rework)
FINEPLACER® CRS (compact rework system for advanced and standard rework)
FINEPLACER® Jumbo (modular rework system for very large board sizes)
FINEPLACER® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications)

*the configuration shown on the picture may contain optional modules 

Related Links back to top  
 

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Applications | Rework & Repair | Lead Free Rework