FINEPLACER® Jumbo*

FINEPLACER^® Jumbo
Rework eXtra Large

FINEPLACER^® rework station for small to medium scale assembly or high precision rework of soldered components on medium to very large size (500 mm x 750 mm) SMD boards.

High accuracy [15 µm (0.8 mil) placement accuracy] allows this machine to be used for smallest components with pitch down to 200 µm. On the other hand, the large field of view [> 104 mm] makes it possible to align very large components, e.g. "Super BGA", with side lenths of up to 73 mm without additional optics. Even larger components can be aligned using FINETECH's Split Field Optics Video Module "MIRAGE".  

Benefits

• Placement accuracy < 15 µm
• Powerful new COMISS reflow module
• Enhanced power for segment bottom heater, easy adaptable to different board sizes
• Patented vision alignment system
• High level of flexibility through modular design
• Optional semi-automatic configuration with motorized swivel module
• Graphical user interface based on WinXP
• Reproducible reflow process
• Easy & user-friendly operation
• Designed for production support and process development
• Ready for sophisticated future technologies
• Low maintenance design
• Low cost of ownership

FINEPLACER^® Pico RS (modular rework system for smallest components and mobile devices)
FINEPLACER^® Micro RS (modular rework system for advanced and standard rework)
FINEPLACER^® Micro HVR (automatic rework station for advanced and standard rework)
FINEPLACER^® CRS (compact rework system for advanced and standard rework)
FINEPLACER^® Jumbo (modular rework system for very large board sizes)
FINEPLACER^® Jumbo HVR (automatic rework station for very large board sizes and standard rework applications)

^{*the configuration shown on the picture may contain optional modules}