FINEPLACER® FEMTO
Automatic Sub Micron Opto-Bonder®
The new FINEPLACER® FEMTO provides auto-touchdown and die placement, as well as controlled bonding operation after automatic alignment of die and substrate. The FINEPLACER® FEMTO is an innovative opto-bonder that offers extreme modularity and flexibility.
With a high placement accuracy of ±0.5 µm, FINEPLACER® FEMTO is the ideal choice for advanced placement and bonding of power lasers, laser bars, assembly of opto-electronic components and more. This versatile system is capable of different bonding technologies, including flip chip (thermocompression, ultrasonic, AuSn and In), dispensing, UV curing, fluxing, ACF and ACP. The system works completely operator-independent, providing stability and increased process safety for production environments.
Applications:
Benefits:
- Placement accuracy ± 0.5 µm
- Automatic vision alignment system
- User independent and reproducible processes
- GUI based on WinXP
- Compact ergonomic design
- Small footprint optimized for clean rooms
- Adaptable to specific applications and future technologies
- Open system architecture
- Designed for production and process & product development
- Low cost of ownership
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