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COMISS - Hot Gas Reflow Module |
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For soldering or changing modern, high-pin-count ICs on high density assembled boards and other substrates, FINETECH has developed the hot gas soldering system COMISS. This module transforms the FINEPLACER® system into a high precision rework station. By goal-directed and exactly defined heat input, soldering tasks can be solved that formerly required hot bar or could not be solved at all.
Temperature control is performed using FINETECH's COMISS (COntrolled MIx Soldering System) which mixes heated and unheated gas. Perfect control of all process parameters means superiority over competing systems: This gives optimal results with minimal stress to the component. The COMISS module is controlled by the reflow software WinCOMISS. |
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Generally, two essential soldering methods can be distinguished: infrared soldering and soldering with hot gas. The table below shows a comparison of infrared soldering and conventional hot gas soldering in terms of their benefits and disadvantages.
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Benefits and Disadvantages of different soldering methods |
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Infrared soldering |
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Conventional hot gas soldering |
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During infrared soldering, the energy for heating up the solder joint will be transmitted by long wave electromagnetic radiation. |
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During hot gas soldering, the energy for heating up the solder joint will be transmitted by a gaseous medium. This can be air or inert gas. |
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Benefits |
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Benefits |
- Easy setup
- No compressed air required
- No component-specific nozzles
- Fast reaction of infrared source
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- Efficient heating, large heat amounts can be transmitted
- Even heating of the affected board area
- More safety, temperature of the component will never exceed the adjusted gas temperature
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Disadvantages |
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Disadvantages |
- Uneven preheating of the board, because central areas will be heated more than peripheral areas
- Temperature can hardly be controlled, peaks cannot be ruled out
- Covering of the neighboured components is necessary
- Surface temperature depends on the component's reflection characteristics: dark surfaces will be heated more than lighter surfaces
- The temperature additionally depends on the surface shape. Convective loss of energy will reduce the temperature of the component
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- Large thermal capacity of the heat generator results in slow reaction whereby thermal profiles can be distorted
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COMISS IV is a hot gas reflow module that combines essential benefits of infrared soldering and hot gas soldering. The gas temperature is measured and controlled directly at the entry of the soldering head. This method guarantees little delay by modulating the mix of cool and hot gas. The heat generator is kept at constant temperature - thus its thermal capacities have no influence on the course of the temperature profile at all. The small thermal capacity of the soldering heads avoids significant corruption of the profiles. Fast analogue closed loop controllers ensure an immediate reaction of the gas temperature to disturbances and modifications of the target temperature. Desired parameters can be followed under all conditions, leading to perfect rework at high reproducibility level.
Essential benefits of COMISS IV: |
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- Contactless heating with hot gas
- Capability to use nitrogen
- Easy switching between hot gas and nitrogen for economic use
- Lowest possible thermal load to board and component
- Short soldering time, minimal thermal stress on chip's surroundings
- Rapid cool down after reflow, resulting in small-grained solder joints
- Exact keeping to required temperature
- Excellent reproducibility of soldering profiles
- Safe temperature management, even during long soldering times
- Changing of soldering tools takes just a few seconds. Suitable for BGA, Fine Pitch QFP, CSP, Chip Carriers, PLCC Sockets, SMT connectors, Small Passive (01005, 0201,...), Flip Chip (see FC3 and FC4) etc.
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One of the outstanding features of COMISS is the excellent grade of reproducibility. It has been further improved by introducing COMISS IVPLUS. The enhanced COMISS version "IVPlus" was specially developed for the demands of mobile device rework. It supports in-field auto-calibration and further improvement of process reliability. By auto-calibrating the integrated measuring system of the reflow module, possible production tolerances can be compensated. This offers several benefits:
- After changing the heating element, no recalibration by qualified staff is needed. The system will recalibrate itself on demand.
- Reflow arms can be interchanged between different machines
- Soldering profiles can be allocated globally. You will get the same results at any place in the world.
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| The Reflow Module COMISS V was specially developed for applications demanding for a higher heat input. It is therefore recommended for large components and boards (e.g. server boards). |
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Three different variants of COMISS are available:
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COMISS1 |
IV |
IVPlus |
V |
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Power |
900 W |
900 W |
1200 W |
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Ramp Steepness |
1...50 K/s |
1...50 K/s |
1...50 K/s |
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Air Flow |
10...70 Nl/min |
10...70 Nl/min |
10...70 Nl/min |
| Air Purity |
according to DIN ISO 8573-1, Class 4 |
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Temperature Deviation |
4% |
2% |
4% |
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Lead Free Approved |
X |
X |
X |
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Controlled Cooling |
X |
X |
X |
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Automatic Calibration |
- |
X |
X |
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Startsensor2 |
X |
X |
X |
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Motorized Theta Movement2 |
X |
X |
X |
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Application (preferred) |
standard
rework |
mobile
devices |
network/
communication | |
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1 COMISS V only for FINEPLACER® Jumbo
2 only for FINEPLACER® Jumbo, Micro and Pico |
Previous manual FINEPLACER® systems can be upgraded to the new COMISS IV version. All new manual FINEPLACER® rework systems will be equipped with COMISS IVPLUS. |
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Original FINETECH Soldering Heads
FINETECH Soldering Heads have to fulfil multiple tasks:
- Pick up the component from the presentation
- Clamp the component during alignment
- Place the component on the PCB
- Heat the component during reflow
In specific cases:
- Apply force to the component
- Supply the working area with shielding gas
According to their task, FINETECH Soldering Heads are task-specific. They solder and desolder different kinds and sizes of SMD components, such as BGA (hard and soft balls), CSP, FC, QFP, PLCC, RF shields, connectors, modules and small passives, on very densely populated boards, e.g. for mobile phones.
All FINETECH Soldering Heads are optimized for lowest thermal mass. This means the influence of heat stored in the soldering head is minimized and hot gas is lead to the connections to solder on the shortest way possible. Working together with FINETECH's COMISS Reflow Module, FINETECH Soldering Heads provide hot gas temperature curses following the desired values with excellent accuracy. Extremely quick preheating and cooling is possible.
For high sensitivity applications, like soldering plastic connectors or replacing RF shields, as well as reworking TAB and flex connectors, custom specific FINETECH Soldering Heads were designed, for soldering within a few seconds and minimizing the thermal stress to the component.
All soldering heads fit into the reflow arm's quick clamping device, making tool change a job of just a few seconds.
Find a selection of original FINETECH soldering heads here. |
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