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What are MEMS & MOEMS?
Micro Assembly describes a certain range of different technologies which are used for high accurate mounting mechanical, optical or electrical parts on a micro scale to carriers. Currently two types of devices are very common: MEMS (Micro Electro Mechanical System) and MOEMS (Micro Optical Electro Mechanical System).
A significant example of a micro assembled module using FINEPLACER® Pico and Lambda is the Infineon “Paroli® “ module.
Micrro assembly technologies:
- UV curing
- Dispensing
- MEMS placement
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Assembly steps of the sub assembly |
| Mounting Process |
Special Demands |
FINEPLACER® Modules |
| VCSEL on submount |
Long device with high precision |
FINEPLACER® with 5 micron precision and large picture area, special vacuum tool. |
| Monitor diode on ceramic chip |
Very small part |
FINEPLACER® 2 micron accuracy, special illumination, special vacuum tool |
| Ceramic chip on submount |
Very high precision |
Bonding force unit |
| Submount on heat sink |
High precision difficult handling |
FINEPLACER® 5 micron accuracy, special illumination |
| PAROLI® module on daughter card |
Very local heating |
Special vacuum tool, FINEPLACER® 5 micron accuracy, hot gas system COMISS, special soldering tool, bottom heating |
| Two tune resistors on PAROLI® unit |
Very local heating |
Special vacuum tool, FINEPLACER® 5 micron accuracy, hot gas system COMISS, special soldering tool, bottom heating | |
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FINETECH's most precise manual base module. For all kinds of device bonding where the placement error must be kept to an absolute minimum. Very suitable for Opto Bonding, Flip Chip Bonding and Micro Electro Mechanics (MEMS) placement. The most flexible system offers excellent accuracy (± 0.5 µm placement accuracy) at a competetive price. |
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FINETECH's most versatile base module. Can be used in a wide field of application for rework (Pico RS) and different kinds of micro assembly, e.g. Flip Chip bonding processes (Pico MA). Offers very high accuracy (5 µm placement accuracy), as well as maximum flexibility. The picture shows a FC bonding configuration. |
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FINETECH's most versatile base module. Can be used in a wide field of application for rework (Pico RS) and different kinds of micro assembly, e.g. Flip Chip bonding processes (Pico MA). Offers very high accuracy (5 µm placement accuracy), as well as maximum flexibility. The picture shows a rework configuration. |
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