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Flip Chip describes an advanced method of electrical interconnection. The Flip Chip device equipped with conductive “bumps” will be assembled in “face down” orientation to a package carrier (substrate) by using a Flip Chip Bonder.
Using AuSn or indium as interconnect are two of the most popular technologies of bonding of single laser or laser bars. The bottom of the die and the top of the sub mount are typically equipped with a AuSn or indium layer. Within a bonding process (temperature and force) the chip is soldered to the sub mount.
Layers or bumps of AuSn or indium material located on chip and substrate are soldered together in a temperature and force process. Of all solders indium provides several key advantages: flow behavior, low melting point, less stress to material and reduced warpage. Force and temperature have to be controlled very precisely during the whole bonding process.
Micro Assembly describes a certain range of different technologies which are used for high accurate mounting mechanical, optical or electrical parts on a micro scale to carriers. Currently two types of devices are very common: MEMS (Micro Electro Mechanical System) and MOEMS (Micro Optical Electro Mechanical System).
RFID (Radio Frequency Identification) is a new field of application for the FINEPLACER®, used for R&D as well as pre series RFID production. The size covers a range from some mm to 0.5 mm. Low placement error becomes more and more important, as RFID dice are undergoing a continuous process of miniaturization. Flexibility and process reproducibility are further "trump cards" for quick process development.
